Senior Advanced Packaging Integrator - Hybrid Bonding

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 120,000 - 190,000; Full time

Job summary

SkyWater Technology, Inc. in Florida seeks a Senior Process Integration Engineer for Advanced Packaging to lead development of Si interposers, FanOut and hybrid bonding flows.

You will guide project teams, translate customer requirements into robust process recipes, and deliver qualified products to clients with high yield. You will collaborate across CAD, metrology, and failure analysis, drive continuous improvement, and communicate progress to management and customers throughout the production

Qualifications

• BS in Engineering required, MS/PhD preferred.
• 7+ years in process development/integration for advanced packaging.
• Experience with FanOut, Si interposers and hybrid bonding.
• DOE, SPC, and six-sigma knowledge with data-driven approach.
• Excellent communication and cross-functional collaboration.

Responsibilities

• Transfer client package requests into a compatible process flow and lead the team to high-yield qualification.
• Develop and optimize process flows for Wafer manufacturing including TSV integration.
• Collaborate with CAD to validate layout files and build metrology structures.
• Use metrology tools to characterize processes and identify root causes.
• Lead optimization tasks to improve device performance and yield.
• Monitor SPC charts and drive continuous improvement.
• Design experiments to validate recipes and deliver final production flow.
• Regularly update customers on project progress and transition to volume production.

Skills

Process integration

Advanced packaging

DOE/ SPC/6-Sigma

Cross-functional collaboration

Problem solving

Oral and written communication

Project management

Education

B.S. in Engineering

M.S./PhD preferred

Tools

Metrology tools

Semiconductor fabrication tools

Job description

SkyWater Technology, Inc. in Florida seeks a Senior Process Integration Engineer for Advanced Packaging to lead development of Si interposers, FanOut and hybrid bonding flows.

You will guide project teams, translate customer requirements into robust process recipes, and deliver qualified products to clients with high yield. You will collaborate across CAD, metrology, and failure analysis, drive continuous improvement, and communicate progress to management and customers throughout the production