Senior Advanced Packaging Process Integration Lead

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 120,000 - 180,000; Full time

Job summary

SkyWater Technology, Inc. in Florida seeks a seasoned Process Integration Engineer to lead Advanced Packaging flows, including Si interposers, FanOut and hybrid bonding, from concept to qualification and production transfer.

You will optimize process recipes, validate layouts, monitor yields, and drive continuous improvement in a fast-paced semiconductor fab. Strong communication and project management are essential for success.

Qualifications

• BS in engineering or related field; MS/PhD preferred.
• 10+ years in process development & integration in Advanced Packaging environments.
• Experience with FanOut wafer level assembly and hybrid bonding processes.

Responsibilities

• Transfer client package requests into a manufacturing flow using Si interposer, FanOut and hybrid bonding.
• Develop and optimize comprehensive process flows and recipes for wafer manufacturing.
• Collaborate with CAD engineers to validate layouts and construct metrology boxes and test structures.
• Utilize metrology tools to characterize process conditions and identify defects root causes.
• Lead improvement initiatives to enhance device performance and yield.

Skills

FanOut wafer level assembly

Hybrid bonding

DOE & SPC & Six Sigma

Cross-functional leadership

Customer communication

Education

BS Engineering

MS/PhD preferred

Tools

Semiconductor fabrication tools

Job description

SkyWater Technology, Inc. in Florida seeks a seasoned Process Integration Engineer to lead Advanced Packaging flows, including Si interposers, FanOut and hybrid bonding, from concept to qualification and production transfer.

You will optimize process recipes, validate layouts, monitor yields, and drive continuous improvement in a fast-paced semiconductor fab. Strong communication and project management are essential for success.