Advanced Packaging Die Placement Engineer - Staff

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 90,000 - 140,000; Full time

Job summary

SkyWater Technology, Inc. in Florida seeks an experienced Die Placement / Pick and Place Development Engineer to lead and improve die placement process flows for advanced packaging.

You will collaborate with clients, process and tool teams, and management to deliver qualified products while driving yield and schedule. You will transfer client requests into robust, integrated flows, develop recipes, and author training and technical papers to spread state-of-the-art capabilities within SkyWater

Qualifications

• BS in Engineering; MS/PhD preferred.
• 5+ years of Process Development & Integration in Advanced Packaging Fab environment.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability and data-driven, inventive solution orientation.

Responsibilities

• Lead die placement/process flow development for client packages (e.g., FanOut, TSV flows).
• Develop recipes and tooling interoperability to meet upstream/downstream needs.
• Create training documents and write technical papers to share state-of-the-art capabilities.
• Monitor process yields and drive improvements via data analysis and root-cause investigation.
• Collaborate with process/tool engineers and external partners to deliver on schedule.

Skills

Process Development

Integration Engineer

DOE

SPC

Six Sigma

Problem solving

Cross-functional collaboration

Education

BS Engineering

MS/PhD preferred

Job description

Position Summary:

We are looking for a hardworking, and passionate experienced Die Placement / Pick and Place Development Engineer for our Florida Advanced Packaging site. In this role, you will be responsible to lead, develop and improve the overall die placement process flows to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Areas of Accountability:

Transfer a client’s package requests into a die placement / pick and place process flow that may utilize Si interposer, FanOut, superconducting materials and hybrid bonding manufacturing processes. The die placement may be incorporated within a final package such as in the fanout flows, be part of hybrid bonding of devices, utilize die last as part of wafer level assembly or utilized in a substrate assembly flow. Identify areas that require development and lead the module team to deliver on schedule and with high yield a qualifiable final product. Highlight any potential gaps in a process flows and build external partnerships to enable fast turn prototyping. When required, lead task forces to identify root causes, correct and maintain product deliverables.

• Support integration engineers to enable new process needs for each project.
• Create training documents & write technical papers to teach state-of-the-art technologies within SkyWater and external.
• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that die placement that comprehend upstream and downstream product requirements and process flows.
• Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
• Integrate TSV first and / or TSV last process flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Utilize data analysis software to drive data driven decisions
• Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
• Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS Engineering, MS/PhD preferred

Experience and Skills:

• 5+ years of Process Development & Integration Engineer in Advanced Packaging Fab environment of 10K and 1K clean rooms related to FanOut wafer level assembly, Quantum, Si Interposer and Hybrid Bonding.
• Advanced Packaging Fab processing tools knowledge/experience
• MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship Required:

This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

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