Semiconductor Packaging: Mechanical Design Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 105,650 - 149,150; Full time

Job summary

Intel Corporation is seeking a Mechanical Design Engineer focused on semiconductor packaging. You will design Tape and Reel packaging, create and maintain mechanical layouts for substrates, IHS, stiffeners and assemblies, and develop trays used in assembly.

You will work with architecture, process and assembly teams to ensure design intent and manufacturability, acting as the primary contact for packaging mechanical collateral and solving design issues with timely execution.

Qualifications

• Bachelor's degree in mechanical engineering or related field required.
• 1+ year of experience with 2D/3D CAD and mechanical design foundations.
• Experience interpreting and creating technical drawings and specifications.

Responsibilities

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and drawings for substrates, IHS, stiffeners and package assemblies.
• Design process media trays used during assembly stages.
• Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.

Skills

2D/3D CAD

Mechanical design

Technical drawings

Education

Bachelor's degree in mechanical engineering or STEM

Master's degree (preferred)

Tools

SolidWorks

Siemens NX

AutoCAD

Job description

Intel Corporation is seeking a Mechanical Design Engineer focused on semiconductor packaging. You will design Tape and Reel packaging, create and maintain mechanical layouts for substrates, IHS, stiffeners and assemblies, and develop trays used in assembly.

You will work with architecture, process and assembly teams to ensure design intent and manufacturability, acting as the primary contact for packaging mechanical collateral and solving design issues with timely execution.