Mechanical Design Engineer - Semiconductor Packaging

Intel Corporation; Phoenix (AZ); On-site; USD 105,650 - 149,150; Full time

Job summary

Intel Corporation is seeking a Mechanical Design Engineer focused on semiconductor packaging. You will design Tape and Reel packaging, create and maintain mechanical layouts for substrates, IHS, stiffeners and assemblies, and develop trays used in assembly.

You will work with architecture, process and assembly teams to ensure design intent and manufacturability, acting as the primary contact for packaging mechanical collateral and solving design issues with timely execution.

Qualifications

• Bachelor's degree in mechanical engineering or related field required.
• 1+ year of experience with 2D/3D CAD and mechanical design foundations.
• Experience interpreting and creating technical drawings and specifications.

Responsibilities

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and drawings for substrates, IHS, stiffeners and package assemblies.
• Design process media trays used during assembly stages.
• Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.

Skills

2D/3D CAD

Mechanical design

Technical drawings

Education

Bachelor's degree in mechanical engineering or STEM

Master's degree (preferred)

Tools

SolidWorks

Siemens NX

AutoCAD

Job description

## Mechanical Design Engineer - Semiconductor PackagingApplylocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0286059# **Job Details:**## Job Description:We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.**Key Responsibilities:*** Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.* Develop and maintain mechanical designs and detailed drawings for: + Substrates + Integrated Heat Spreaders (IHS) + Stiffeners + Overall package assemblies* Design process media trays used during various stages of the assembly process.* Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.* Act as the single point of contact for all packaging mechanical design collateral needs.* Proactively identify and solve design and process issues, ensuring timely project execution.**Behavioral traits*** Problem-solving skills and a proactive approach to challenges.* Excellent communication and interpersonal skills for effective cross-functional collaboration.* Manage multiple tasks and projects simultaneously under tight deadlines.## **Qualifications:**Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.**This position is not eligible for Intel immigration sponsorship**Knowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.**Minimum Qualifications*** Bachelor's degree in mechanical engineering or in a STEM related field of study.* 1+ year of experience in: + 2D and 3D CAD software. + Mechanical design foundation and 3D spatial awareness. + Interpret and generate technical drawings and specifications.**Preferred Qualifications*** Master's degree in mechanical engineering or in a STEM related field of study.* 2+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD is highly preferred.* Experience in semiconductor packaging or related high-precision manufacturing environments.* Familiarity with material properties and mechanical tolerances used in package design and tooling.## Job Type:College Grad## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \* Job posting details (such as work model, location or time type) are subject to change.