Mechanical Design Engineer - Semiconductor Packaging

Intel Corporation; Phoenix (AZ); On-site; USD 106,000 - 149,000; Full time

Job summary

Intel Corporation in Phoenix, Arizona is seeking a proactive Mechanical Design Engineer to lead collateral design activities supporting semiconductor packaging architecture. You will design and develop mechanical components and tooling throughout the packaging and assembly lifecycle, requiring strong communication and project management with minimal supervision.

Collaborating with architecture, process and assembly teams, you will ensure design intent and manufacturability, serve as the single

Qualifications

• Bachelor's degree in mechanical engineering or STEM related field.
• 1+ year of experience in 2D and 3D CAD software.
• Mechanical design foundation and 3D spatial awareness.
• Interpret and generate technical drawings and specifications.

Responsibilities

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and detailed drawings for substrates, IHS stiffeners, and package assemblies.
• Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Act as the single point of contact for all packaging mechanical design collateral needs.
• Proactively identify and solve design and process issues to ensure timely project execution.

Education

Bachelor's degree in mechanical engineering

Tools

SolidWorks

Siemens NX

AutoCAD

Job description

Job Details: Job Description: We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Key Responsibilities

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and detailed drawings for: Substrates, Integrated Heat Spreaders (IHS) Stiffeners, Overall package assemblies, Design process media trays used during various stages of the assembly process.
• Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Act as the single point of contact for all packaging mechanical design collateral needs.
• Proactively identify and solve design and process issues, ensuring timely project execution.

Behavioral traits

• Problem-solving skills and a proactive approach to challenges.
• Excellent communication and interpersonal skills for effective cross-functional collaboration.
• Manage multiple tasks and projects simultaneously under tight deadlines.

Qualifications

• Minimum qualifications are required to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• This position is not eligible for Intel immigration sponsorship Knowledge and/or experience listed below would be obtained through a combination of your school/work and/or classes and/or research and/or relevant previous job and/or internship experiences.
• Minimum Qualifications Bachelor's degree in mechanical engineering or in a STEM related field of study.
• 1+ year of experience in: 2D and 3D CAD software.
• Mechanical design foundation and 3D spatial awareness.
• Interpret and generate technical drawings and specifications.
• Preferred Qualifications Master's degree in mechanical engineering or in a STEM related field of study.
• 2+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD is highly preferred.
• Experience in semiconductor packaging or related high-precision manufacturing environments.
• Familiarity with material properties and mechanical tolerances used in package design and tooling.

Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Position of Trust N/A

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $105,650.00-149,150.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.

• Job posting details (such as work model, location or time type) are subject to change.
• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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