IC Packaging Design Engineer, Amazon Leo

Anysilicon; San Diego (CA); Hybrid; USD 150,000 - 190,000; Full time

Job summary

Anysilicon and Amazon Leo collaborate to design IC packages for RF chips used in satellite systems in San Diego. The role focuses on defining floorplans, bump maps, stack-ups, and rigorous 3D simulations to ensure high performance and reliability.

You will coordinate with RF designers, vendors, and antenna teams to optimize package options, materials, and thermal management, aiming for volume production readiness.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years RF design experience; volume production track record.
• RF communication systems expertise.
• Strong RF fundamentals and power integrity knowledge.

Responsibilities

• Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN.
• Setup and run 3D electromagnetic simulations of package + PCB using HFSS and Momentum to verify designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning.

Skills

RF design

Full-custom packages/PCBs

High-speed interfaces

RF fundamentals

Power integrity

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical or Communications Engineering (preferred)

Tools

HFSS

Momentum

Job description

IC Packaging Design Engineer, Amazon Leo

Job Description:

Amazon Leo is launching a constellation of Low Earth Orbit satellites to provide high-speed broadband connectivity to underserved communities globally. We are seeking an IC Packaging Design Engineer to join our innovative team.

Responsibilities:

• Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB using tools like HFSS and Momentum to verify designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning.

Qualifications:

• Bachelor's degree in Electrical Engineering or a related field.
• 5+ years of experience in RF design, preferably in an advanced node.
• Proven track record where products have gone to volume production.
• Experience with RF communication systems.

Skills:

• Master's degree in Electrical or Communications Engineering or a related field (preferred).
• 7+ years of experience designing full-custom packages/PCBs for high performance chips (preferred).
• Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components.
• Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
• Experience routing high-speed, high pin count digital and analog interfaces (e.g., SERDES, CPU, memory).
• Understanding of package materials properties related to high-volume production and reliability.