Remote Solutions Architect: Hyperscale AI Datacenters

3M; California; Hybrid; USD 165,000 - 201,000; Full time

Benefits offered by this job

Medical, Dental & Vision

Health Savings Accounts

Flexible Spending Accounts

Disability Benefits

Life Insurance

Retirement Benefits

Job summary

3M is seeking a Solutions Architect to lead technical engagements with hyperscale datacenter customers and compute vendors. You will translate roadmaps into inputs for 3M product teams and help shape the AI datacenter roadmap for the EBO program.

This remote role can be based in the Bay Area with travel up to 30%. Ideal candidates have a Bachelor's in Electrical/Computer Engineering and 5+ years in hyperscale datacenters, AI architectures, or optical interconnects, plus strong communication and

Qualifications

• Bachelor’s degree in Electrical Engineering, Optical/Photonics, or Computer Engineering.
• Minimum 5 years of experience with hyperscale datacenter customers, AI architectures, or optical interconnect technologies.
• Strong technical communication and collaboration skills.

Responsibilities

• Lead technical engagements with hyperscale datacenter customers and compute vendors.
• Translate roadmaps into actionable inputs for product and technology teams.
• Support sales, applications engineering, and marketing with technical context.

Skills

hyperscale datacenter experience

AI architectures

optical interconnect

co-packaged optics

strong communication

Education

Bachelor’s degree in Electrical/Computer Engineering

Master’s degree in EE/Optical Engineering

Job description

3M is seeking a Solutions Architect to lead technical engagements with hyperscale datacenter customers and compute vendors. You will translate roadmaps into inputs for 3M product teams and help shape the AI datacenter roadmap for the EBO program.

This remote role can be based in the Bay Area with travel up to 30%. Ideal candidates have a Bachelor's in Electrical/Computer Engineering and 5+ years in hyperscale datacenters, AI architectures, or optical interconnects, plus strong communication and