Remote SI/PI Engineer for AI/ML Hardware

Spd-Technology

United States

Remote

USD 120,000 - 180,000

Full time

4 days ago
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Job summary

SPD Technology seeks a Signal Integrity/Power Integrity Engineer to shape AI/ML hardware acceleration with TPU-oriented designs. You will verify complex digital designs, lead chip/package design, and ensure SI/PI performance from concept to production while collaborating across cross-functional teams.

Requirements include a bachelor’s in EE/CE/CS and 8+ years in SI/PI for chips, packages, or PCBs, plus hands-on modeling with HFSS/ADS/Sigi rity/Siwave.

Qualifications

  • Bachelor's degree or equivalent in electrical/computer engineering or related field.
  • 8+ years in SI/PI design for chip, package, or system PCB.
  • Experience with industry SI/PI modeling tool chains (HFSS, ADS, Sigrity, Siwave).
  • Lab bring-up, test environments, and characterization for high-speed memory/SerDes.
  • Cross-team partnership across chip architecture, physical design, STA and validation.
  • Programming in Python, MATLAB, or C++ to automate flows.

Responsibilities

  • Lead SI and PI analysis and optimization for HPC using advanced packaging.
  • Influence chip floorplanning, PDN/power trees, nets and routability tradeoffs.
  • Evaluate high-speed interface IPs and develop memory interfaces across IO/SI/PI.
  • Drive post-silicon validation and qualification for NPI and packaging.
  • Collaborate with silicon, system and vendor teams to boost modeling accuracy.

Skills

SI/PI design
HFSS
Siwave
Sigrity
Python
C++
MATLAB

Education

Bachelor's degree in EE/CE/CS

Tools

HFSS
ADS
Sigrity
Siwave

Job description

SPD Technology seeks a Signal Integrity/Power Integrity Engineer to shape AI/ML hardware acceleration with TPU-oriented designs. You will verify complex digital designs, lead chip/package design, and ensure SI/PI performance from concept to production while collaborating across cross-functional teams.

Requirements include a bachelor’s in EE/CE/CS and 8+ years in SI/PI for chips, packages, or PCBs, plus hands-on modeling with HFSS/ADS/Sigi rity/Siwave.

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