Remote RF Package Design Engineer - EM & SoC Packaging

Otava Rf; Moorestown Township (NJ); Hybrid; USD 110,000 - 160,000; Full time

Job summary

Otava Inc., based in Moorestown, New Jersey, develops RF and millimeter-wave chips and SoCs. We seek an EM/Package Design Engineer with strong RF/MW analysis background and some package design experience to join our collaborative team.

The ideal candidate will perform electromagnetic analysis of 2.5D/3D packages, design multi-chip packages in Allegro, and present results in design reviews while contributing to development opportunities and career growth.

Qualifications

• MSEE or PhD in Electrical Engineering is required.
• Graduate school experience or 3+ years in EM modeling or IC is expected.
• Design with an interest in EM modeling is encouraged.
• Experience with 3D electromagnetic solvers such as HFSS is preferred.
• Experience with Cadence Virtuoso Schematic and Layout design flow is required.
• Strong team player mindset, self-driven and able to overcome design challenges.

Responsibilities

• Electromagnetic analysis of 2.5D and 3D microelectronic packages.
• Design and layout of multi-chip packages in Allegro Package Designer.
• Organize and present clear technical results during design reviews.

Skills

EM modeling

Team player

Self-driven

Communication

Education

MSEE or PhD in Electrical Engineering

Tools

HFSS

Cadence Virtuoso

Job description

Otava Inc., based in Moorestown, New Jersey, develops RF and millimeter-wave chips and SoCs. We seek an EM/Package Design Engineer with strong RF/MW analysis background and some package design experience to join our collaborative team.

The ideal candidate will perform electromagnetic analysis of 2.5D/3D packages, design multi-chip packages in Allegro, and present results in design reviews while contributing to development opportunities and career growth.