EM- Package Design Engineer

Otava Rf; Moorestown Township (NJ); Hybrid; USD 110.000 - 160.000; Vollzeit

Zusammenfassung

Otava Inc., based in Moorestown, New Jersey, develops RF and millimeter-wave chips and SoCs. We seek an EM/Package Design Engineer with strong RF/MW analysis background and some package design experience to join our collaborative team.

The ideal candidate will perform electromagnetic analysis of 2.5D/3D packages, design multi-chip packages in Allegro, and present results in design reviews while contributing to development opportunities and career growth.

Qualifikationen

• MSEE or PhD in Electrical Engineering is required.
• Graduate school experience or 3+ years in EM modeling or IC is expected.
• Design with an interest in EM modeling is encouraged.
• Experience with 3D electromagnetic solvers such as HFSS is preferred.
• Experience with Cadence Virtuoso Schematic and Layout design flow is required.
• Strong team player mindset, self-driven and able to overcome design challenges.

Aufgaben

• Electromagnetic analysis of 2.5D and 3D microelectronic packages.
• Design and layout of multi-chip packages in Allegro Package Designer.
• Organize and present clear technical results during design reviews.

Kenntnisse

EM modeling

Team player

Self-driven

Communication

Ausbildung

MSEE or PhD in Electrical Engineering

Tools

HFSS

Cadence Virtuoso

Jobbeschreibung

New Jersey Area (hybrid)
New England Area (fully remote)

Otava Inc., based in Moorestown, New Jersey, is a fabless semiconductor company specializing in RF and millimeter-wave technologies. Our mission is to provide cutting- edge radio frequency integrated solutions for emerging defense, 5G/6G, and satellite communication applications. As a small and growing company, we concentrate on developing high-performance, wideband chips and system-on-chip (SoC) solutions.

We are seeking an enthusiastic and collaborative EM / Package Design Engineer to join our dynamic team. The ideal candidate will possess a strong technical background in RF and Microwave Electromagnetic analysis as well as some experience with package design and layout. This position requires excellent communication skills and a self-driven mindset, presenting significant opportunities for professional development and career advancement.

Key Responsibilities:

• Electromagnetic analysis of 2.5D and 3D microelectronic packages
• Design and layout of multi-chip packages in Allegro Package Designer
• Organize and present clear technical results during design reviews

Qualifications:

• MSEE or PhD in Electrical Engineering (required)
• Graduate school experience or 3+ years of industry experience in EM modeling or IC
• design with an interest in EM modeling
• Experienced with 3D electromagnetic solvers, such as HFSS
• Experienced with Cadence Virtuoso Schematic and Layout design flow.
• Strong team player mindset, driven to overcome design challenges, learn and succeed
• U.S. citizenship or Green Card holder (required)