IC Package Design & RF Modeling Engineer

NXP Semiconductors NV

Austin (TX)

On-site

USD 120,000 - 180,000

Full time

14 days+

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

engineeringjobs.net, Inc. seeks a specialist to develop optimized electrical package designs balancing performance, manufacturability, and cost. You will perform electromagnetic modeling and collaborate with SoC, PCB, and layout teams to enhance package I/O and overall system performance.

The role requires a master's degree in electrical engineering and experience in microelectronics packaging design, with preferred capabilities in RF design, antenna modeling, and cross-functional communication.

Qualifications

  • Master's degree in electrical engineering with microelectronics packaging experience.
  • Experience in electromagnetic modeling and packaging design is required or strongly preferred.

Responsibilities

  • Develop optimized electrical package designs that meet performance and cost targets.
  • Perform and document electromagnetic modeling and system-level simulations.
  • Collaborate with SoC, PCB and layout teams to improve I/O performance.

Skills

IC Package Design
Electromagnetic Modeling
Electromagnetic Simulation
RF Design
RF and Multi-Gigahertz Modeling
Antenna Modeling
Signal Integrity
Power Integrity
I/O Interface Design
PCB Design
Package Layout Optimization
System-Level Simulation
Electrical Performance Optimization
Communication and Presentation
Cross-Functional Collaboration

Education

Master's degree in Electrical Engineering

Tools

Electromagnetic simulation tools

Job description

engineeringjobs.net, Inc. seeks a specialist to develop optimized electrical package designs balancing performance, manufacturability, and cost. You will perform electromagnetic modeling and collaborate with SoC, PCB, and layout teams to enhance package I/O and overall system performance.

The role requires a master's degree in electrical engineering and experience in microelectronics packaging design, with preferred capabilities in RF design, antenna modeling, and cross-functional communication.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Remote RF Package Design Engineer - EM & SoC Packaging
Remote RF Package Design Engineer - EM & SoC Packaging

Otava Rf • Moorestown Township (NJ)

Hybrid
USD 110,000 - 160,000
RF Electromagnetics & Packaging Design Engineer
RF Electromagnetics & Packaging Design Engineer

Texas Instruments Incorporated • Dallas (TX)

On-site
USD 120,000 - 180,000
RF Packaging & Design Engineer
RF Packaging & Design Engineer

Heisler Semiconductor LLC • Maryland

On-site
USD 90,000 - 130,000
RF/mmWave Packaging Engineer - Design, Test & Validate
RF/mmWave Packaging Engineer - Design, Test & Validate

Heisler Semiconductor LLC • Maryland

On-site
USD 90,000 - 130,000
High-Frequency EM Modeling & Packaging Engineer
High-Frequency EM Modeling & Packaging Engineer

Texas Instruments • Dallas (TX)

On-site
USD 110,000 - 160,000
RF Design Engineer II: Microwave Packaging
RF Design Engineer II: Microwave Packaging

M-Wave Design Corporation • Simi Valley (CA)

Hybrid
USD 90,000 - 130,000
Employer contributions to Medical, ...
Staff RF/Microwave Module Design Engineer
Staff RF/Microwave Module Design Engineer

Qorvo, Inc. • Richardson (TX)

On-site
USD 120,000 - 160,000
Lead Electrical Engineer — RF, SI & EMI Packaging
Lead Electrical Engineer — RF, SI & EMI Packaging

Qnity • Sunnyvale (CA)

On-site
USD 147,000 - 230,000
On-site
Competitive pay & benefits
Mentorship opportunities
RF Design Engineer II — Microwave Packaging & Testing
RF Design Engineer II — Microwave Packaging & Testing

M Wave Design Corporation • Strathearn (CA)

On-site
USD 80,000 - 110,000
Medical, Dental, Vision plans
Sr. RF Engineer
Sr. RF Engineer

TALENT Software Services • South Carolina

On-site
USD 90,000 - 130,000