Senior IC Packaging Designer

Falcomm; Atlanta (GA); On-site; USD 90,000 - 140,000; Full time

Benefits offered by this job

Equity package

Health insurance

401(k) plan

Paid time off

Job summary

Falcomm seeks an IC Packaging Designer to advance RFIC packaging solutions for high-frequency performance and manufacturability. You will design and optimize packages, layouts, and substrates, collaborating with RFIC designers, layout engineers, and manufacturing partners to enable production-ready integration.

Ideal candidates have 3–5 years in RFIC packaging up to 50 GHz, experience with wirebond/flip-chip/PoP/SiP, and proficiency in major packaging tools, with full-time onsite work in

Qualifications

• 3–5 years of experience designing RFIC semiconductor packages up to 50 GHz.
• Experience with wirebond, flip-chip, PoP, or SiP packaging.
• Proficiency with Cadence Allegro APD/SiP or Mentor Xpedition.

Responsibilities

• Design RFIC packages and substrates optimized for high-frequency performance.
• Create package layouts, bond diagrams, and substrate routing using packaging EDA tools.
• Collaborate with SI/EM/thermal teams to validate package performance.
• Produce documentation, fabrication drawings, and assembly specs.
• Contribute to design reviews, prototyping, and failure analysis to improve RF performance and yield.
• Co-optimize chip and package performance with RFIC designers to minimize parasitics.
• Support PCB integration to ensure system-level RF performance.
• Coordinate with fabrication and assembly partners.

Skills

RF packaging

High-frequency design

Signal integrity

Education

Bachelor’s degree in Electrical Engineering or related discipline

Tools

Cadence Allegro APD/SiP

Mentor Xpedition

HFSS

Q3D

PowerSI

CAM350

Valor

Calibre

Ansys Electronics Desktop

Icepak

Job description

Description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.

Responsibilities

• Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
• Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
• Work with signal integrity, EM, and thermal simulation teams to validate package performance.
• Generate package documentation, fabrication drawings, and assembly specifications.
• Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
• Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
• Support package integration with PCB design teams to ensure optimal RF performance at the system level.
• Coordinate with fabrication and assembly partners.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
• 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
• Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
• Must be willing to work full-time, onsite, in Atlanta, GA.

Preferred Skills

• Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
• Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
• Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
• Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits

• Competitive Salary and Equity Package
• Comprehensive Health, Dental, and Vision Insurance
• 401(k) Retirement Plan
• Paid Time Off (PTO) and Sick Leave

Disclosure

• Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
• Applicants wishing to view a copy of Falcomm’s Affrimative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
• To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.