RF Packaging & Design Engineer

Heisler Semiconductor LLC; Maryland; On-site; USD 90,000 - 130,000; Full time

Job summary

Heisler Semiconductor LLC seeks an RF Packaging Engineer to own the RF side of design work. You will work directly with the founder and process team from RFQ through design, build and measurement.

Responsibilities include designing RF/mmWave packaging interconnects, running EM simulations, laying out boards, characterizing with a VNA, and collaborating to turn designs into builds that perform as intended.

Qualifications

• BS or MS in EE with RF coursework.
• Hands-on use of at least one EM or RF simulation tool.
• Experience measuring RF hardware with a VNA.
• Clear technical writing and comfort working directly with customers.

Responsibilities

• Design RF and mmWave packaging interconnects and interfaces.
• Run EM and circuit simulation for matching, loss and isolation.
• Lay out evaluation boards and test fixtures and take them through fabrication.
• Characterize parts on a VNA and report results.
• Review RFQs for technical feasibility and help scope quotes.
• Collaborate with assembly and process engineers to turn designs into builds.

Skills

RF packaging design

EM simulation tools

VNA measurements

Customer communication

Education

BS or MS in Electrical Engineering with RF coursework

Tools

HFSS

Sonnet

ADS or similar

Job description

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. We take work from design through assembly and characterization. Demand is growing quickly, especially for RF and mmWave packaging, and we're building the team to meet it.

The role

You'll own the RF side of our design work: making sure a die performs once it's in a package, on a board, or in a module. You'll work directly with the founder and our process team, from a customer's first RFQ through design, build and measurement.

What you'll do

• Design RF and mmWave packaging interconnects: wire bond and flip-chip transitions, substrates, launches, and package-to-board interfaces.
• Run EM and circuit simulation (HFSS, Sonnet, ADS or similar) for matching, loss and isolation.
• Lay out evaluation boards and test fixtures, and take them through fabrication.
• Characterize parts on a VNA (S-parameters, de-embedding, fixture calibration) and report the results.
• Review incoming RFQs for technical feasibility and help scope quotes.
• Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

• BS or MS in Electrical Engineering with RF or microwave coursework or research.
• Hands-on use of at least one EM or RF simulation tool.
• Experience measuring RF hardware with a VNA.
• Clear technical writing, and comfort working directly with customers.

Nice to have

• mmWave (30 GHz+) packaging, flip-chip, or glass/organic interposer experience.
• PCB layout (Altium, KiCad or similar).
• Cleanroom or microelectronics assembly exposure.

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

How to apply

Apply through this page with your resume and a short note on an RF design or measurement project you're proud of.

Heisler Semiconductor is an equal opportunity employer.