Remote Package Design Engineer – 2.5D/3.5D HPC

SPD Technology; United States; A distancia; USD 140.000 - 210.000; Jornada completa

Descripción de la vacante

SPD Technology is seeking a Package Design Engineer to join our Silicon Integration team. You will develop package substrate designs for 2.5D/3.5D packaging technologies used in high‑performance ML and AI chips, collaborating with SI/PI, thermal, mechanical, and PCB teams to optimize electrical performance and manufacturability.

The role covers routing feasibility, test vehicles, product-level designs, design reviews, and manufacturing documentation, with global, fully remote work and a focus on

Formación

• Bachelor's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Technology, Science, or related field.
• 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
• Experience in chip package substrate layout, design verification, DFM and taping out for production.
• Experience in design automation and scripting.
• English — Upper Intermediate or higher.

Responsabilidades

• Develop package substrate designs for large form-factor packages for ML HPCs.
• Define and implement CAD flow for efficient substrate design and productivity.
• Lead co-design initiatives across chip, package, and system levels with production sign-off.
• Collaborate with SI/PI, thermal, and mechanical teams to refine product designs.
• Define requirements for package substrate design and BOM.

Conocimientos

Chip package design

Cadence APD

Mentor Expedition

Design verification

Scripting

English proficiency

Educación

Bachelor's degree in Mechanical or Electrical Engineering or related

Herramientas

Cadence APD

Mentor Expedition

Descripción del empleo

SPD Technology is seeking a Package Design Engineer to join our Silicon Integration team. You will develop package substrate designs for 2.5D/3.5D packaging technologies used in high‑performance ML and AI chips, collaborating with SI/PI, thermal, mechanical, and PCB teams to optimize electrical performance and manufacturability.

The role covers routing feasibility, test vehicles, product-level designs, design reviews, and manufacturing documentation, with global, fully remote work and a focus on