Senior SoC Physical Design Engineer — Remote

SPD Technology; United States; À distance; USD 140 000 - 210 000; Plein temps

Résumé du poste

SPD Technology is seeking a Senior Silicon Physical Design Engineer to join our AI and Infrastructure team. You will design chips, subsystems, and sign off convergence to meet power, performance, and area goals, collaborating with design, DFT, architecture and packaging engineers.

Fully remote role with a flexible schedule, international collaboration, and opportunities to push hardware-enabled AI solutions for consumer products.

Qualifications

• Bachelor’s degree or higher in a relevant field or equivalent practical experience.
• 5 years of SoC design cycles experience.
• Experience with advanced design: clock/voltage domain crossing, DFT, low power designs.
• Experience in high-performance, high-frequency, low-power designs.
• Master’s/PhD preferred in EE/CE/CS with emphasis on computer architecture.
• Experience with scripting languages such as Perl, Python, or Tcl.

Responsabilités

• Use problem-solving and simulation techniques to ensure PPA meet defined requirements.
• Collaborate with cross-functional teams to debug failures or performance shortfalls in lab or simulation.
• Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route and sign-off convergence.
• Develop, validate, and improve EDA methodologies for specialized sign-off or implementation domains.

Connaissances

PPA optimization

SoC design cycles

Cross-functional collaboration

Scripting (Perl, Python, Tcl)

Formation

Bachelor’s degree in Electrical Engineering, Computer Engineering, or Computer Science

Master’s degree or PhD in EE / CE / CS (preferred)

Outils

Perl

Python

Tcl

Description du poste

SPD Technology is seeking a Senior Silicon Physical Design Engineer to join our AI and Infrastructure team. You will design chips, subsystems, and sign off convergence to meet power, performance, and area goals, collaborating with design, DFT, architecture and packaging engineers.

Fully remote role with a flexible schedule, international collaboration, and opportunities to push hardware-enabled AI solutions for consumer products.