Remote Package Design Engineer, 2.5D/3.5D HPC Substrates

Software Product Development Company; United States; À distance; USD 120 000 - 180 000; Plein temps

Résumé du poste

SPD Technology is seeking a Package Design Engineer to develop large form-factor package substrate designs for ML HPCs and to optimize the CAD flow for efficiency. You will coordinate with SI/PI, thermal, mechanical, and PCB teams to advance substrate architectures and enable reliable production.

The role emphasizes delivering design verification, DFM readiness, and production sign-off, while leveraging automation and scripting to boost productivity in a remote, global team environment.

Qualifications

• 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
• Experience in chip package substrate layout, design verification, DFM and taping out for production.
• Experience in design automation and scripting.
• English — Upper Intermediate or higher.

Responsabilités

• Develop physical package substrate design of large form-factor package for ML high-performance computers.
• Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
• Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
• Collaborate with SI/PI, thermal, and mechanical teams to refine product designs, test vehicles, and mock-up designs for feasibility.

Connaissances

Chip packaging design

Design automation

Scripting

Cross-functional collaboration

Formation

Bachelor's in Mechanical Engineering

Bachelor's in Electrical Engineering

Outils

Cadence APD

Mentor Expedition

Description du poste

SPD Technology is seeking a Package Design Engineer to develop large form-factor package substrate designs for ML HPCs and to optimize the CAD flow for efficiency. You will coordinate with SI/PI, thermal, mechanical, and PCB teams to advance substrate architectures and enable reliable production.

The role emphasizes delivering design verification, DFM readiness, and production sign-off, while leveraging automation and scripting to boost productivity in a remote, global team environment.