Reliability Engineer: ASIC & HTOL Lab Specialist

Broadcom Inc.; Fort Collins (CO); On-site; USD 110,000 - 176,000; Full time

Benefits offered by this job

Medical

Dental and vision plans

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Paid sick leave

Vacation time

Job summary

Broadcom Inc. in Fort Collins, CO, seeks a Reliability Engineer for its Global Operations Quality Assurance Team. The role focuses on reliability qualifications for silicon and packaging, with hands-on work across BUs and external vendors.

Responsibilities include HTOL vector conversion, thermal design review, and cross-functional coordination to meet qualification milestones. Strong hardware/ASIC experience and communication skills are essential.

Qualifications

• BS degree in Engineering or related field and 8+ years of related experience.
• Demonstrated understanding of reliability qualification stress tests (HTOL/HTS/TC/THB).
• Experience with schematic design and PCB layout review.

Responsibilities

• Board hardware schematic and layout review.
• Thermal head simulation and design review.
• Liaise between external vendors and internal Business Units (BUs).
• Convert HTOL vectors to run on MCC HTOL systems.
• Provide technical engineering support for the REL Lab team.
• Board/socket debug for setup or vector issues.
• Complete initial biased stress certifications.
• Develop biased/unbiased stress testing plans for projects.
• Manage stress project schedules to milestones.
• Ensure REL project completion to meet qualification expectations.

Skills

Reliability engineering

Hardware design

ASIC test engineering

Schematic design

PCB layout design

HTOL testing

Stress testing

Debugging

Cross-functional communication

Education

Bachelor's degree in Engineering

Tools

MCC HTOL

AEHR Test Sonoma HTOL

Automated Test Equipment (ATE)

Job description

Broadcom Inc. in Fort Collins, CO, seeks a Reliability Engineer for its Global Operations Quality Assurance Team. The role focuses on reliability qualifications for silicon and packaging, with hands-on work across BUs and external vendors.

Responsibilities include HTOL vector conversion, thermal design review, and cross-functional coordination to meet qualification milestones. Strong hardware/ASIC experience and communication skills are essential.