R&D Process Integration Engineer – 28/22nm CMOS

Texas Instruments

Lehi (UT)

Vor Ort

USD 120.000 - 160.000

Vollzeit

vor 1 Stunde
Sei unter den ersten Bewerbenden

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Zusammenfassung

Texas Instruments in Lehi, Utah is seeking an experienced Process Integration Engineer to drive 28nm/22nm technology development for embedded and analog products. You will collaborate with a cross-functional team to define process requirements, run DOE studies, and push parametric and yield improvements on a modern 300mm fab.

Responsibilities include applying device physics, data analysis and simulations to advance process and device performance while partnering with process, reliability,

Qualifikationen

  • Master’s degree in electrical engineering or related semiconductor field.
  • 3+ years in a semiconductor factory environment, with advanced CMOS tech experience.
  • Proven strength in DOE, data analysis and translating learning into improvements.

Aufgaben

  • Apply device physics and model-based problem solving to resolve integration issues and yield improvements.
  • Help define process requirements, specifications, and success criteria for process flows.
  • Drive process and device improvements through characterization, DOE, data analysis and simulations.
  • Apply BKMs for advanced CMOS nodes below 28nm.
  • Collaborate with process, integration, reliability, packaging and test teams to meet program goals.
  • Work with product groups to optimize process performance for differentiated products.

Kenntnisse

DOE
Data analysis
Process optimization
Cross-functional collaboration

Ausbildung

M.S. in Electrical Engineering
Semiconductor-focused discipline (solid-state/ applied physics)

Tools

HKMG expertise

Jobbeschreibung

Texas Instruments in Lehi, Utah is seeking an experienced Process Integration Engineer to drive 28nm/22nm technology development for embedded and analog products. You will collaborate with a cross-functional team to define process requirements, run DOE studies, and push parametric and yield improvements on a modern 300mm fab.

Responsibilities include applying device physics, data analysis and simulations to advance process and device performance while partnering with process, reliability,

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