Quantum Packaging Engineer - 2.5D/3D & Cryogenic Tech

Google LLC

Goleta (CA)

On-site

USD 159,000 - 230,000

Full time

7 hours ago

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Job summary

Google LLC in Goleta, CA is seeking an Advanced Packaging Development Engineer for Quantum AI to advance packaging technologies for superconducting quantum processors and related components in cryogenic environments.

You will pioneer 2.5D/3D integration and novel interconnects, working with quantum processor and RF teams to turn research into deployable packaging solutions that scale our quantum computing systems.

Qualifications

Bachelor’s degree in Electrical/Computer Engineering, Physics or related field, or equivalent practical experience.
5 years of experience in 3 of the following areas: simulation, layout & design, process engineering, assembly, test & measurement, failure analysis.
5 years of experience with 2.5D/3D integration, wafer level packaging, panel level packaging, bump bonding.
3 years of experience delivering R&D concepts to a released product.
3 years of experience developing advanced packaging solutions.

Responsibilities

Design, architect, and implement novel packaging platforms.
Investigate and characterize electrical, thermal, and mechanical properties of packaging materials.
Develop and document new process flows and Design-For-Integration (DfI) principles for emerging technologies.
Lead technical engagements with external vendors and partners to evaluate, co-develop, and qualify next-generation packaging processes and components outside of the current standard manufacturing processes.
Conduct root cause analysis and develop mitigation strategies for performance-limiting factors (e.g., yield, reliability, signal integrity) unique to those new technologies.