Quantum Packaging Backend Engineer – Dicing & Bonding

Amazon Web Services (AWS); Pasadena (CA); On-site; USD 123,000 - 160,000; Full time

Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a fabrication backend engineer to advance packaging and backend processes for quantum computing devices. You will work on dicing, wirebonding, flip chip bonding and probing in a hands-on lab environment on-site.

The role emphasizes data-driven process improvement, collaboration with design and test teams, and the ability to troubleshoot equipment to meet production goals. A degree in engineering or science is required.

Qualifications

• Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent.
• 2 years hands‑on experience in dicing, wire bonding, flip chip bonding
• 2 years experience with wafer level and die level processing in cleanroom
• Experience with developing new processes, SPC and failure analysis
• Experience analyzing experimental and observational data sets
• Ability to manage multiple tasks/projects and work independently or with mixed teams

Responsibilities

• Partner with Design, Test, and Frontend Fabrication to integrate backend modules and refine device probing, packaging, and measurement methodologies.
• Lead sustainment and development of packaging processes including dicing, wirebonding, flip chip bonding and device characterization.
• Operate and maintain equipment to achieve optimal outcomes and minimize downtime.
• Design, build, and maintain backend process infrastructure and standardize work practices.
• Analyze process data to identify trends, improve stability, and drive yield improvement.

Skills

Dicing

Wire bonding

Flip-chip bonding

Wafer processing

Process data analysis

Statistical process control

Independent work

Team collaboration

Education

Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent

Job description

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a fabrication backend engineer to advance packaging and backend processes for quantum computing devices. You will work on dicing, wirebonding, flip chip bonding and probing in a hands-on lab environment on-site.

The role emphasizes data-driven process improvement, collaboration with design and test teams, and the ability to troubleshoot equipment to meet production goals. A degree in engineering or science is required.