Quantum Fabrication Backend Engineer - Pasadena (Onsite)

Amazon Inc.; Pasadena (CA); On-site; USD 123,000 - 160,000; Full time

Benefits offered by this job

Health insurance

RSU program

401(k) matching

Paid time off

Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA seeks a fabrication backend engineer to support packaging and backend processes for quantum computing devices. You will work in a hands-on lab environment with dicing, wirebonding, flip chip bonding and device characterization.

The role emphasizes collaboration with Design, Test, and Frontend Fabrication teams, and involves developing robust process infrastructure, troubleshooting, and sustaining packaging workflows.

Qualifications

• Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent.
• 2 years hands-on experience in dicing, wire bonding, flip chip bonding.
• 2 years experience with wafer level and die level process in the cleanroom.
• Experience with developing new processes, statistics process control and failure analysis.
• Experience analyzing both experimental and observational data sets.
• Able to manage multiple tasks/projects independently or in a team.

Responsibilities

• Partner with Design, Test, and Frontend Fabrication teams to integrate new backend modules into devices and refine probing, packaging, and measurement methodologies.
• Lead sustainment and development of packaging processes including dicing, wirebonding, flip chip bonding and device characterization.
• Operate and maintain equipment to ensure optimal outcomes and minimize downtime.
• Design, build, and maintain backend process infrastructure and implement standardized work practices.
• Analyze process data to identify trends, improve stability, and drive yield improvement.

Skills

Dicing

Wire bonding

Flip chip bonding

Wafer level process

Data analysis

Project management

Education

Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent

Tools

Cleanroom

Device packaging equipment

Statistical process control

Job description

Amazon Development Center U.S., Inc. in Pasadena, CA seeks a fabrication backend engineer to support packaging and backend processes for quantum computing devices. You will work in a hands-on lab environment with dicing, wirebonding, flip chip bonding and device characterization.

The role emphasizes collaboration with Design, Test, and Frontend Fabrication teams, and involves developing robust process infrastructure, troubleshooting, and sustaining packaging workflows.