Fabrication Backend Engineer, AWS CQC - Fabrication

Amazon Web Services (AWS); Pasadena (CA); On-site; USD 123,000 - 160,000; Full time

Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a fabrication backend engineer to advance packaging and backend processes for quantum computing devices. You will work on dicing, wirebonding, flip chip bonding and probing in a hands-on lab environment on-site.

The role emphasizes data-driven process improvement, collaboration with design and test teams, and the ability to troubleshoot equipment to meet production goals. A degree in engineering or science is required.

Qualifications

• Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent.
• 2 years hands‑on experience in dicing, wire bonding, flip chip bonding
• 2 years experience with wafer level and die level processing in cleanroom
• Experience with developing new processes, SPC and failure analysis
• Experience analyzing experimental and observational data sets
• Ability to manage multiple tasks/projects and work independently or with mixed teams

Responsibilities

• Partner with Design, Test, and Frontend Fabrication to integrate backend modules and refine device probing, packaging, and measurement methodologies.
• Lead sustainment and development of packaging processes including dicing, wirebonding, flip chip bonding and device characterization.
• Operate and maintain equipment to achieve optimal outcomes and minimize downtime.
• Design, build, and maintain backend process infrastructure and standardize work practices.
• Analyze process data to identify trends, improve stability, and drive yield improvement.

Skills

Dicing

Wire bonding

Flip-chip bonding

Wafer processing

Process data analysis

Statistical process control

Independent work

Team collaboration

Education

Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent

Job description

Description

The Center for Quantum Computing (CQC) is seeking a fabrication backend engineer. The CQC is a multi-disciplinary team of scientists, engineers, and technicians, on a mission to develop a fault-tolerant quantum computer. We are looking to hire a hardware development engineer with dicing, wirebonding, flip chip bonding or electrical probing experience. The engineer will focus on backend processes to support both production and R&D activities. The position is on-site at our lab, located on the in Pasadena, CA. The ideal candidate will have had prior experience in the device packaging area. We are looking for candidates with strong engineering principles, resourcefulness and a data-driven approach. Organization and communication skills are essential.

Key job responsibilities

• Partner closely with other teams (e.g., Design, Test, and Frontend Fabrication) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction.
• Lead the sustainment and development of packaging process including dicing, wirebonding, flip chip bonding and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.

A day in the life

The schedule is late afternoon through late night for this role, 4pm-1am for example. The initial training will be performed in the day time. Once the training is finished, the candidate is expected to work independently in the assigned hours.

The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects.

Diverse Experiences

Amazon values diverse experiences. Even if you do not meet all of the preferred qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasn’t followed a traditional path, or includes alternative experiences, don’t let it stop you from applying.

Work/Life Balance

We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home, which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home, there’s nothing we can’t achieve in the cloud.

Inclusive Team Culture

Here at AWS, it’s in our nature to learn and be curious. Our employee-led affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences, including our Conversations on Race and Ethnicity (CORE) and AmazeCon (gender diversity) conferences, inspire us to never stop embracing our uniqueness.

Mentorship and Career Growth

We’re continuously raising our performance bar as we strive to become Earth’s Best Employer. That’s why you’ll find endless knowledge-sharing, mentorship and other career-advancing resources here to help you develop into a better-rounded professional.

Export Control Requirement Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility.

About The Team

The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination.

The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.

Basic Qualifications

• Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent
• 2 years of hands‑on experience in one or more of the following areas: dicing, wire bonding, flip chip bonding
• 2 years experience with hands‑on wafer level and die level process in the cleanroom
• Experience with developing new process, statistics process control and failure analysis activities
• Experience analyzing both experimental and observational data sets
• Effective at managing multiple tasks/projects and working independently or within a team environment with other scientists, engineers, and technicians who might have a wide range of technical skill levels

Preferred Qualifications

• 2 years working in microfabrication in a research and development setting
• Experience in characterization for packaging process and devices (e.g. inferred microscope, shear test, pull test, SEM, profilometer)
• Strong verbal, written, and data presentation skills

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, CA, Pasadena - 122,600.00 - 160,000.00 USD annually

Company - Amazon Development Center U.S., Inc.

Job ID: A10597831