Quantum Device Backend Tech: Die Prep & Hybridization

Google; Goleta (CA); On-site; USD 99,000 - 140,000; Full time

Job summary

Google is seeking a Hardware Testing Engineer in Goleta, CA to support quantum processor development. You will prepare and inspect dies, manage die and device inventory, and perform die handling and hybridization with a flip chip bump bonder.

Close collaboration with design and backend teams ensures protocols meet high reliability standards. Responsibilities include documenting defect types, measuring post-hybridization parameters, and following strict cleanroom safety practices while

Qualifications

• Associate's degree or equivalent practical experience in a relevant technical field.
• 3 years of clean room experience.
• 3 years with microfabrication equipment and processes.
• 3 years with photoresist stripping, optical inspection equipment, profiler, and die handling.
• 3 years of handling Silicon wafers or similar substrates.

Responsibilities

• Image dies for Quantum device builds and generate die defect reports.
• Manage die and device inventory and perform hybridization with flip chip bump bonder.
• Measure post-hybridization parameters.
• Collaborate with backend engineers to develop robust backend processes.
• Follow cleanroom and safety protocols.

Skills

Clean room experience

Microfabrication equipment

Die handling

Silicon wafers handling

Education

Associate's degree / equivalent technical training

Tools

MES system

Flip chip bonder

Google Sheets/Docs/Slides

Job description

Google is seeking a Hardware Testing Engineer in Goleta, CA to support quantum processor development. You will prepare and inspect dies, manage die and device inventory, and perform die handling and hybridization with a flip chip bump bonder.

Close collaboration with design and backend teams ensures protocols meet high reliability standards. Responsibilities include documenting defect types, measuring post-hybridization parameters, and following strict cleanroom safety practices while