Quantum Device Backend Technician: Die Prep & Hybridization

Google Inc.; Goleta (CA); On-site; USD 99,000 - 140,000; Full time

Job summary

Google Inc. is seeking a Share Device Backend Technician for the Quantum AI team in Goleta, CA. The role focuses on die preparation, cleaning, imaging, inspection, defect reporting, and inventory management within a cleanroom environment.

You will enable high-quality quantum processor packaging by performing die-level work and hybridizing devices using flip-chip bump bonding. You will collaborate with backend engineers to refine processes, ensure safety, and adhere to Google's quality standards

Qualifications

• Associate's degree or equivalent in a technical field or related training.
• At least 3 years in a clean room environment.
• At least 3 years of experience with microfabrication equipment and processes.
• At least 3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling.
• Experience handling Silicon wafers or equivalent substrates.

Responsibilities

• Manage die and device inventory and hybridize devices with flip chip bump bonder.
• Measure post-hybridization parameters.
• Work with backend engineers to develop robust backend processes.
• Die preparation and cleaning, imaging and inspecting dies, documenting defect types, generating die defect reports, and managing die and device inventory.

Skills

Clean room

Microfabrication

Photoresist stripping

Optical inspection

Profiler

Die handling

Silicon wafers

Education

Associate's degree or equivalent

Tools

MES system

Google Docs/Sheets

Flip chip bonder

Die cleaning

Inventory management

Job description

Google Inc. is seeking a Share Device Backend Technician for the Quantum AI team in Goleta, CA. The role focuses on die preparation, cleaning, imaging, inspection, defect reporting, and inventory management within a cleanroom environment.

You will enable high-quality quantum processor packaging by performing die-level work and hybridizing devices using flip-chip bump bonding. You will collaborate with backend engineers to refine processes, ensure safety, and adhere to Google's quality standards