Device Backend Technician, Quantum AI

Google Inc.; Goleta (CA); On-site; USD 99,000 - 140,000; Full time

Job summary

Google Inc. is seeking a Share Device Backend Technician for the Quantum AI team in Goleta, CA. The role focuses on die preparation, cleaning, imaging, inspection, defect reporting, and inventory management within a cleanroom environment.

You will enable high-quality quantum processor packaging by performing die-level work and hybridizing devices using flip-chip bump bonding. You will collaborate with backend engineers to refine processes, ensure safety, and adhere to Google's quality standards

Qualifications

• Associate's degree or equivalent in a technical field or related training.
• At least 3 years in a clean room environment.
• At least 3 years of experience with microfabrication equipment and processes.
• At least 3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling.
• Experience handling Silicon wafers or equivalent substrates.

Responsibilities

• Manage die and device inventory and hybridize devices with flip chip bump bonder.
• Measure post-hybridization parameters.
• Work with backend engineers to develop robust backend processes.
• Die preparation and cleaning, imaging and inspecting dies, documenting defect types, generating die defect reports, and managing die and device inventory.

Skills

Clean room

Microfabrication

Photoresist stripping

Optical inspection

Profiler

Die handling

Silicon wafers

Education

Associate's degree or equivalent

Tools

MES system

Google Docs/Sheets

Flip chip bonder

Die cleaning

Inventory management

Job description

Share Device Backend Technician, Quantum AI

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corporate_fare Google place Goleta, CA, USA

Early

Experience completing work as directed, and collaborating with teammates; developing knowledge of relevant concepts and processes.

Share Device Backend Technician, Quantum AI

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• Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.
• 3 years of experience working in a clean room environment.
• 3 years of experience with microfabrication equipment and processes.
• 3 years of experience with photoresist stripping, optical inspection equipment, profiler, and die handling.
• 3 years of experience handling Silicon (Si) wafers or similar substrate form factors.

Preferred qualifications:

• Experience with flip chip bonder or die cleaning process.
• Experience with inventory management.
• Experience using a MES system.
• Proficiency in Google Sheets/Docs/Slides or similar applications.

About the job

Google's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets Google's standards of quality and reliability.

The Quantum Device Backend team is responsible for delivering the highest quality quantum processors to packaging. This includes die leveling cleaning, imaging die, inspecting die, hybridize devices, and post measurement after hybridization. Our team provides die preparation and device build services and also focuses on developing robust bump bonding processes. You will work as part of the backend team and be responsible for delivering the highest quality quantum processors to packaging. Your backend processing responsibilities will include die preparation and cleaning, imaging and inspecting dies, documenting defect types, generating die defect reports, and managing die and device inventory. Additionally, you will hybridize devices using a flip chip bump bonder, measure post-hybridization parameters like alignment and chip gap, and work closely with backend engineers to develop die preparation and hybridization processes while strictly following cleanroom and safety protocols.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $99000 - $140000 (USD) + 15% bonus target + equity + benefits

• Manage die and device inventoryand hybridize devices with flip chip bump bonder.
• Measure post hybridization parameters.
• Work with backend engineers closely to develop robust backend process.

Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents-to-be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy , Know your rights: workplace discrimination is illegal , Belonging at Google , and How we hire .

Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting.

Equity is granted exclusively and discretionarily by Alphabet Inc. on the basis of an agreement concluded between you and Alphabet Inc. Alphabet Inc. is your sole contractual partner with respect to equity grants. GSU grants are not guaranteed, are discretionary, are subject to approval by the Alphabet Inc. board of directors or its delegate, the terms of the relevant Alphabet Inc. stock plan, and your grant agreement. They have no impact on statutory payments. Current or past grants do not confer an acquired right.