Quantum Backend Process Engineer: Die Bonding

Google LLC; Goleta (CA); On-site; USD 108,000 - 153,000; Full time

Benefits offered by this job

Equity

Bonus target 15%

Benefits package

Job summary

Google LLC in Goleta, CA, is seeking a Fabrication Backend Process Engineer for Quantum AI to advance die singulation, hybridization, and device characterization. You will develop scalable bonding and die preparation processes and work with cross-functional teams to optimize yield and reliability.

The role emphasizes equipment qualification, process integration, and rigorous attention to quality standards, with compensation including equity and a 15% bonus target in addition to benefits.

Qualifications

• 1 year of experience in a wafer level or die level cleanroom environment.
• 1 year of experience with SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
• 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.
• Experience with data analysis and visualization tools such as JMP, Python, or SQL.

Responsibilities

• Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid troubleshooting to minimize downtime.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability.
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).

Job description

Google LLC in Goleta, CA, is seeking a Fabrication Backend Process Engineer for Quantum AI to advance die singulation, hybridization, and device characterization. You will develop scalable bonding and die preparation processes and work with cross-functional teams to optimize yield and reliability.

The role emphasizes equipment qualification, process integration, and rigorous attention to quality standards, with compensation including equity and a 15% bonus target in addition to benefits.