Fabrication Backend Process Engineer, Quantum AI

Google LLC; Goleta (CA); On-site; USD 108,000 - 153,000; Full time

Benefits offered by this job

Equity

Bonus target 15%

Benefits package

Job summary

Google LLC in Goleta, CA, is seeking a Fabrication Backend Process Engineer for Quantum AI to advance die singulation, hybridization, and device characterization. You will develop scalable bonding and die preparation processes and work with cross-functional teams to optimize yield and reliability.

The role emphasizes equipment qualification, process integration, and rigorous attention to quality standards, with compensation including equity and a 15% bonus target in addition to benefits.

Qualifications

• 1 year of experience in a wafer level or die level cleanroom environment.
• 1 year of experience with SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
• 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.
• Experience with data analysis and visualization tools such as JMP, Python, or SQL.

Responsibilities

• Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid troubleshooting to minimize downtime.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability.
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).

Job description

Fabrication Backend Process Engineer, Quantum AI

Share Fabrication Backend Process Engineer, Quantum AI

corporate_fare Google place Goleta, CA, USA

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  
• 1 year of experience in a wafer level or die level cleanroom environment.
• 1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
• 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
  
• Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing structural bonding solutions.
• Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry.
• Experience with statistical process control and failure analysis activities.
• Experience with data analysis and visualization tools such as JMP, Python, or SQL.

About the job

As a Fabrication Backend Process Engineer, you will play a role in the development and manufacturing of our quantum processor devices. You will be responsible for the die singulation process, die cleaning process, hybridization process, and device characterization modules. Your expertise will be crucial in developing scalable bonding processes and die preparation processes that meet the quality standards. You will collaborate closely with cross-functional teams, including design, test, integration and front-end engineers, to optimize device performance, yield, and reliability. Additionally, you will play a key role in the qualification of equipment and processes to establish and maintain an advanced packaging technique. The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error‑corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications. Individual pay is determined by factors including job‑related skills, experience, and relevant education or training.

US: $108000 - $153000 (USD) + 15% bonus target + equity + benefits

Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents-to-be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy , Know your rights: workplace discrimination is illegal , Belonging at Google , and How we hire .

Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting.

To all recruitment agencies: Google does not accept agency resumes. Please do not forward resumes to our jobs alias, Google employees, or any other organization location. Google is not responsible for any fees related to unsolicited resumes.

Equity is granted exclusively and discretionarily by Alphabet Inc. on the basis of an agreement concluded between you and Alphabet Inc. Alphabet Inc. is your sole contractual partner with respect to equity grants. GSU grants are not guaranteed, are discretionary, are subject to approval by the Alphabet Inc. board of directors or its delegate, the terms of the relevant Alphabet Inc. stock plan, and your grant agreement. They have no impact on statutory payments. Current or past grants do not confer an acquired right.

Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction.

• Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
  
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.