Quantum 3D Integration Engineer

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D bonding integration engineer for the Quantum Advanced Packaging team in Vermont, USA. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, with cross-functional collaboration and emphasis on yield improvement and cost reduction.

The position requires a bachelor’s or master’s in a relevant engineering field, internship experience, a minimum 3.0 GPA, and willingness to travel up to 10%.

Qualifications

• Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Internship or co‑op experience required.
• Minimum 3.0 GPA and good academic standing.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop wafer/die level 2.5D and 3D integration processes.
• Develop expertise in materials, processes, and tooling; leverage characterization resources.
• Understand and address failure modes to improve yields and reduce cycle time and costs.
• Generate IP related to wafer integration and packaging technology.
• Work with other teams on various assignments as needed.

Education

Bachelor’s or Master’s in Engineering

Job description

GlobalFoundries is seeking a motivated R&D bonding integration engineer for the Quantum Advanced Packaging team in Vermont, USA. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, with cross-functional collaboration and emphasis on yield improvement and cost reduction.

The position requires a bachelor’s or master’s in a relevant engineering field, internship experience, a minimum 3.0 GPA, and willingness to travel up to 10%.