Quantum 3DHI Engineer (2027 New College Graduate)

Global Foundries; Essex Junction (VT); In loco; USD 85.000 - 146.000; Tempo pieno

Descrizione del lavoro

GlobalFoundries is seeking a motivated R&D bonding integration engineer for the Quantum Advanced Packaging team in Vermont, USA. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, with cross-functional collaboration and emphasis on yield improvement and cost reduction.

The position requires a bachelor’s or master’s in a relevant engineering field, internship experience, a minimum 3.0 GPA, and willingness to travel up to 10%.

Competenze

• Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Internship or co‑op experience required.
• Minimum 3.0 GPA and good academic standing.

Mansioni

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop wafer/die level 2.5D and 3D integration processes.
• Develop expertise in materials, processes, and tooling; leverage characterization resources.
• Understand and address failure modes to improve yields and reduce cycle time and costs.
• Generate IP related to wafer integration and packaging technology.
• Work with other teams on various assignments as needed.

Formazione

Bachelor’s or Master’s in Engineering

Descrizione del lavoro

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

New College Graduate Overview:

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.

Summary of Role:

GlobalFoundries is seeking a motivated R&D bonding integration engineer to become part of our Quantum Advanced Packaging team. This role will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding.

Essential Responsibilities:

• Drive 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials suppliers for the Quantum Advanced Packaging projects.
• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes.
• Develop expertise in the processes, materials and tooling leveraging available characterization resources.
• Drive a mechanistic understanding of failure modes.
• Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
• Generate IP related to novel wafer integration & packaging technology.
• Work and collaborate with other teams regarding different assignments as needed.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Other duties as assigned by manager.

Required Qualifications:

• Education - Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Prior related internship or co-op experience.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Preferred Qualifications:

• PhD education level preferred.
• Fundamental knowledge of semiconductor packaging process modules and integration.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

#NCGProgramUS Expected Salary Range$85,000.00 - $146,000.00The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.