Principal Process Engineer

NOKIA

Allentown (Lehigh County)

On-site

USD 110,000 - 150,000

Full time

14 days+
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Job summary

The Nokia Allentown site is seeking a Principal Development Engineer to lead development, characterization, and transfer of assembly processes to high-volume manufacturing. You will interface with multiple engineering groups and document process details for transfer to production.

Responsibilities include designing DOE experiments, applying statistical analysis, and developing tooling and fixtures. Strong hands-on experience with optoelectronic assembly, alignment, bonding, and CAD tools

Qualifications

  • Experience designing and evaluating manufacturing processes from concept through transfer to production.
  • Proficient in DOE and statistical analysis applied to process development.

Responsibilities

  • Develop, characterize, and qualify manufacturing processes from concept through development and transfer to manufacturing.
  • Design, execute, and analyze experiments using DOE and statistical techniques.
  • Design tooling and fixturing for assigned processes.
  • Set up process checks and documentation for transfer to manufacturing.
  • Lead and perform FMEAs and RCCA actions; train technicians and oversee calibration.

Skills

DOE
Statistical analysis
CAD tools

Education

Bachelor's degree in Engineering
MS degree in Engineering

Tools

Creo
SolidWorks

Job description

The Principal Process DevelopmentEngineer is responsible for developing new and/or expanding current assembly process platforms and transferring them to manufacturing. He or she must be a multitasking team player and able to interface with multiple engineering groups. The person should have hands - on experience with process development and be well versed in mechanical engineering or materials science as well as with auto-mated equipment in a high - volume manufacturing environment. He or she should be an adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, the commercial bonding, flex circuit interconnect technologies such as u-flex, or pick and place machines with adhesive dispening capability; Design of Experiments (DOE), Failur eMode Effects Analysis (FMA), innovative data production, and statistical analysis. Experience working in a clean room environment is a plus. Candidate must be able to precisely document and communicate assembly process details for successful transfer of assigned processes to manufacturing.

  • Develop, characterize, and qualify manufacturing processes from concept through development and transfer to manufacturing, including specifying and procuring equipment, process flow, process development/verification, and qualification plan
  • Design, execute, and analyze experiments through DOE and statistical techniques using statistical tools
  • Design tooling and fixturing for assigned processes.
  • Set up and conduct process checks and complete process documentation for assigned processes to be successfully transitioned from Development into Manufacturing
  • Lead and perform Failure Mode Analysis (FMA) techniques as part of process characterization and Root Cause Corrective Action (RCCA) plans
  • Train technicians and oversee equipment calibration and maintenance scheduling
  • Develop all required documentation for processes that transfer to manufacturing
  • BSDDEEREE in Engineering with 6 to 10 years of experience or MS degreeing, 5 Plus years of experience
  • Demonstrated ability to independently initiate, prioritize, and drive projects to completion
  • Ability to effectively communicate ideas, concepts, and results to both highly technical and non-technical co-workers within cross-functional teams
  • Ability to function independently as well as in a team environment
  • Hands-on experience with optoelectronic module assembly processes including optical device alignment, free space optics, fiber attachment of fiber pig-tailed, flex circuit interconnect, vacuum soldering chambers, hot bar solder equipment, flip chip processing, pick and place, adhesive dispensing and thermal cycling
  • Proven experience in design and process development functions
  • Highly motivated team player adept at working and meeting goals across -functional
  • Experience in high volume manufacturing a plus
  • Excellent written and verbal communication skills combined with a high attention to detail
  • Ability to use CAD to overlay such as Creo and / or SolidWorks
  • Working knowledge of mechanical drawings and dimensional tolerances
  • Understanding of optics is a plus
  • Ability to maintain a clean and safe working environment
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