Process Engineering Manager

Avo Photonics; Horsham (PA); On-site; USD 140,000 - 190,000; Full time

Job summary

Avo Photonics is seeking a diligent Process Engineering Manager to lead the Process Engineering Team. You will oversee die bonding, wire bonding, seam sealing, laser welding, optical alignment and epoxy attach processes, while guiding engineers in process development and qualification for manufacturing transfer.

Responsibilities include tool maintenance, documentation control, and cross-functional communication with Product Engineering.

Qualifications

• Bachelor’s degree or higher in a technical field such as engineering, physics or chemistry.
• 10 years in electronics packaging including die bonding and wire bonding.
• 6 years in engineering management with DOE and process development experience.
• Proven ability to manage technical personnel and lead cross-functional teams.
• Strong problem-solving, organizational and analytical skills.

Responsibilities

• Manage the Process Engineering Team responsible for opto-mechanical assembly processes.
• Oversee training and development of Process Engineers for capability growth.
• Maintain and calibrate manufacturing and development tools.
• Promote research and adoption of new techniques in opto-electronic packaging.
• Facilitate communication between Product Engineers and process teams.
• Support training and qualification of manufacturing personnel on new processes.
• Review DOE, process development work, and control limits.
• Create and maintain Work Instructions and Quality Documents.
• Support travelers for Process Engineering steps and procedures.
• Update consumables, epoxy, fixtures, and software documentation.

Skills

Process engineering leadership

Team management

Documentation & quality

DOE / process development

Problem solving

Education

Bachelor’s degree in engineering/physics/chemistry or related field

Tools

Document control systems

Process control software

Job description

Avo Photonics (www.avophotonics.com) is a dynamic contract engineering services company that designs, develops, and manufactures custom opto-electronic products for a large customer base. Members of our staff have the opportunity to design, prototype and produce next generation products for a diverse range of markets including environmental, medical, military, industrial, aerospace, and communications.

We seek a diligent, dedicated, and meticulous person who will help to further our success and reputation in the industry. The successful candidate must plan his/her own work schedule to meet project deadlines, keep multiple records, be self-motivated and detail oriented, maintain a professional presence, and have the desire to take ownership of projects.

Specifically

• Manage the Process Engineering Team responsible for fundamental opto-mechanical assembly processes including die bonding, wire bonding, seam sealing, laser welding, optical alignment, and epoxy attach processes
• Oversee training and development of Process Engineers to ensure growth in capability and cross-training between processes
• Ensure all manufacturing and development tools are maintained and calibrated
• Promote team research and engagement of new techniques and options supporting opto-electronic packaging; have members present findings and recommendations to Product System Engineering Team
• Facilitate communications from Product Engineers’ processes and requirements to your team’s understanding, refinement, finalization, and ownership of the processes
• Support training and qualification of manufacturing personnel on developed processes that are transferred to manufacturing
• Review design of experiments, process development, and equipment process control limit monitoring performed by the process engineering team
• Oversee creation and maintenance of Work Instructions and related Quality Documents for all processes developed by Process Engineering Team
• Support Product Engineering Team in developing Travelers for Process Engineering related steps and procedures
• Update documentation for Consumables, Epoxy, Fixtures, and Software sections of Document Control system in line with the latest best practices and understanding

Requirements

• Bachelor’s degree or higher in engineering, physics, chemistry or other technical field
• 10 years of experience in electronics packaging, including die bonding and wire bonding
• 6 years of experience in engineering management
• Demonstrated experience creating design of experiments, developing processes, and monitoring process control limits
• Demonstrated ability to manage technical personnel
• Demonstrated problem-solving, organization, and analytical skills
• Strong verbal and written communication skills