Sr. Process Development Engineer

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 95,000 - 135,000; Full time

Job summary

SkyWater Technology, Inc. in Florida seeks a Process Development Engineer to lead, develop, and optimize an Advanced Packaging process flow for MEMS/Photonic devices.

You will communicate with customers, colleagues, and management to drive robust processes and improved yields. Responsibilities include developing/transfering processes, creating manufacturable recipes for deposition/etch/CMP, and monitoring process metrics.

Qualifications

• BS in engineering with 2–4 years of experience.
• MS or PhD with 0–2 years experience.

Responsibilities

• Develop, transfer, and integrate new processes.
• Create manufacturable process recipes for metal deposition, dielectric deposition, photo, etch, or CMP.
• Process integration for MEMS/Photonic devices.
• Utilize metrology tools to characterize process conditions and document results.
• Investigate integration changes to improve device performance and yield.
• Monitor SPC charts and electrical test parametrics.
• Collaborate with process and tool engineers to drive improvements.
• Potential to evolve into a Project Management role.

Skills

Fab tools knowledge

MEMS/Photonic integration

DOE/ SPC/ Six Sigma

Project management

Problem solving

Cross-functional teamwork

Education

BS Engineering

MS/PhD with 0-2 years exp.

Job description

Position Summary:

We are looking for a hardworking, and passionate experienced Process Development Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Area of Accountabilities:

• New process development/transfer/integration in a manufacturing environment.
• Develop or integrate robust manufacturable process recipes for Foundry customers in one or more of metal deposition, dielectric deposition, photo, etch, or CMP areas.
• Process integration for MEMS/Photonic devices advanced packaging backend of line.
• Utilize metrology tools to characterize process conditions and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Monitor and improve electrical test parametrics.
• Could develop into a Project Management position integrating Customer device requests. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required

Required Qualifications:

Education: BS Engineering 2-4 years of exp., MS/PhD with 0-2 years exp.

Experience and Skills:

• Fab processing tools knowledge/experience.
• MEMS/Photonic device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship Required:

This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.