Principal Silicon Photonics & Packaging Engineer

Micron Technology, Inc.; New York (NY); Hybrid; USD 131,000 - 241,000; Full time

Job summary

Micron Technology, Inc. in the United States seeks a Principal Photonics Integration Engineer to lead silicon photonics integration, packaging, and heterogeneous integration efforts, accelerating memory and data center technology.

You will work across design, device, packaging and manufacturing teams to solve complex challenges, using AI tools to speed development and influence Micron's technology roadmap.

Qualifications

• PhD or equivalent with extensive industry experience required or MS/5+ yrs with relevant background.
• Experience integrating silicon photonics in semiconductor environments.
• Strong knowledge of process integration, wafer fabrication, DOE, and statistics.
• Experience with process flow, device integration, design rules, and tape out.
• Proven record leading cross-functional technical projects using data-driven methods.

Responsibilities

• Develop and optimize end-to-end silicon photonics integration flows from concept to manufacturing readiness.
• Lead integration and development for photonic devices, optical interconnects, and advanced packaging.
• Drive DOE, yield improvement, defect reduction, root-cause analysis, and process optimization.
• Collaborate with design, device, packaging, manufacturing, and supplier teams on tapeouts and tech transfers.
• Lead programs and AI-enabled initiatives to accelerate development and improve performance.

Skills

Silicon photonics integration

Semiconductor process integration

DOE methodology

Statistical analysis

Device integration

Tape-out execution

AI-enabled engineering tools

Multifunctional project leadership

Education

PhD in Electrical Engineering, Materials Science, Physics, Photonics, or related field

MS with 5+ years of relevant industry experience

Bachelor's with 7+ years of relevant industry experience

Job description

Micron Technology, Inc. in the United States seeks a Principal Photonics Integration Engineer to lead silicon photonics integration, packaging, and heterogeneous integration efforts, accelerating memory and data center technology.

You will work across design, device, packaging and manufacturing teams to solve complex challenges, using AI tools to speed development and influence Micron's technology roadmap.