Principal Silicon Photonics Integration Engineer

Micron Technology

Boise (ID)

On-site

USD 180,000 - 240,000

Full time

14 days+

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Job summary

Micron Technology is seeking a Principal Photonics Integration Engineer to join the Advanced Packaging Technology Development (APTD) team. You will lead development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity across memory, storage, and data infrastructure.

This role combines process integration, advanced packaging, device development, and program leadership.

Qualifications

PhD or equivalent experience in a related field and >3 years of industry experience.
Experience integrating silicon photonics processes in manufacturing environments.
Strong knowledge of semiconductor process integration, wafer fabrication, DOE, and statistical analysis.
Experience with design rule development, tape out execution, and process flow architecture.
Proven ability to lead multi-functional technical projects using data-driven approaches.

Responsibilities

Develop and optimize end-to-end process integration flows for silicon photonics from concept to manufacturing readiness.
Lead integration and process development for photonic devices, optical interconnects, and heterogeneous architectures.
Drive DOE, yield improvement, defect reduction, root-cause investigations, and process optimization.
Partner with design, device, packaging, manufacturing, and supplier teams for tapeouts and tech transfers.
Lead programs and AI-enabled initiatives to improve development efficiency and product performance.