Principal Photonics Integration Engineer

Micron Technology; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Job summary

Micron Technology is seeking a Principal Photonics Integration Engineer to join the Advanced Packaging Technology Development (APTD) team. You will lead development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity across memory, storage, and data infrastructure.

This role combines process integration, advanced packaging, device development, and program leadership.

Qualifications

• PhD or equivalent experience in a related field and >3 years of industry experience.
• Experience integrating silicon photonics processes in manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, DOE, and statistical analysis.
• Experience with design rule development, tape out execution, and process flow architecture.
• Proven ability to lead multi-functional technical projects using data-driven approaches.

Responsibilities

• Develop and optimize end-to-end process integration flows for silicon photonics from concept to manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, and heterogeneous architectures.
• Drive DOE, yield improvement, defect reduction, root-cause investigations, and process optimization.
• Partner with design, device, packaging, manufacturing, and supplier teams for tapeouts and tech transfers.
• Lead programs and AI-enabled initiatives to improve development efficiency and product performance.

Skills

Leadership in multi-functional teams

AI-enabled engineering tools

Education

PhD in Electrical Engineering / related field

Master's with 5+ years of experience

Bachelor's with 7+ years experience

Tools

Silicon photonics processes

Advanced packaging (hybrid/wafer bonding)

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications.

Principal Photonics Integration Engineer

The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap.

As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making.

Responsibilities

• Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance

Minimum Qualifications

• A PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field, or equivalent experience, is required along with over 3 years of applicable industry experience. Alternatively, a Master's degree or comparable experience with more than 5 years of relevant industry background is acceptable. Candidates holding a Bachelor's degree or equivalent experience and upwards of 7 years in the industry will also be considered.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis
• Experience with process flow architecture, device integration, design rule development, and tape out execution
• Demonstrated success leading multi-functional technical projects and using data-driven approaches to solve sophisticated engineering challenges

Preferred Qualifications

• Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms
• Experience with advanced packaging technologies including hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications
• Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges
• Strong communication, program leadership, and project management skills with the ability to influence technical and business collaborators across organizations

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.