Principal Photonics Integration Engineer

Micron; Boise (ID); On-site; USD 150,000 - 230,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off and holidays

AI-enabled engineering tools access

Job summary

Micron Technology seeks a Principal Photonics Integration Engineer to lead the development and integration of silicon photonics and heterogeneous integration for high-performance optical connectivity across data centers and AI accelerators. You will drive cross-functional collaboration across research, device, packaging, and manufacturing to bring concepts to production.

The role requires strong program leadership, deep process integration experience, and the use of AI-enabled engineering tools

Qualifications

• PhD or equivalent experience with 3+ years in industry, or Master’s with 5+ years, or Bachelor’s with 7+ years.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, DOE, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tape out execution.
• Demonstrated success leading multi-functional technical projects using data-driven approaches.

Responsibilities

• Develop and optimize end-to-end process integration flows for silicon photonics from concept through manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging, and heterogeneous integration architectures.
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization.
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers.
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives to improve development efficiency and product performance.

Skills

Process integration

DOE methodology

Statistical analysis

AI-enabled engineering

Project leadership

Education

PhD in Electrical Engineering, Materials Science, Physics, Photonics or related

Master's degree with 5+ years of relevant experience

Bachelor's degree + 7 years of industry experience

Tools

Wafer bonding equipment

Heterogeneous integration platforms

Industrial photonics equipment

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications

Principal Photonics Integration Engineer

The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making.

Responsibilities:

• Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance

Minimum Qualifications:

• A PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field, or equivalent experience, is required along with over 3 years of applicable industry experience.
• Alternatively, a Master's degree or comparable experience with more than 5 years of relevant industry background is acceptable.
• Candidates holding a Bachelor's degree or equivalent experience and upwards of 7 years in the industry will also be considered.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis
• Experience with process flow architecture, device integration, design rule development, and tape out execution
• Demonstrated success leading multi-functional technical projects and using data-driven approaches to solve sophisticated engineering challenges

Preferred Qualifications:

• Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms
• Experience with advanced packaging technologies including hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications
• Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges
• Strong communication, program leadership, and project management skills with the ability to influence technical and business collaborators across organizations

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [e-mail] or 1-800-336-8918 (select option #3).

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.