Principal Package Development Engineer — Hybrid

Rambus; San Jose (CA); Hybrid; USD 180,000 - 260,000; Full time

Job summary

Rambus in San Jose, CA is seeking a Principal Package Development Engineer to lead early chip-package co-design and select package technologies for high-performance products. You will drive cross-functional collaboration with design, SI/PI, Test, Quality, Reliability, Manufacturing, and Supply Chain to deliver reliable, low-defect package solutions.

The role requires deep expertise in semiconductor packaging technologies, qualification methods, and transfer to high-volume production.

Qualifications

• Bachelor’s degree in Materials Science, Mechanical, Electrical, Chemical or related field.
• 7+ years semiconductor package development experience.
• Experience developing multiple semiconductor package types and transitioning to volume production.
• Knowledge of flip-chip, wire-bond, wafer-level, leadframe-based, and organic laminate package technologies.
• Experience with high-speed or high-pin-count semiconductor devices.
• Understanding of SI, PI, thermal, mechanical and reliability considerations in package development.
• Experience with OSAT partners and suppliers.
• Understanding of package-material properties and their impact on manufacturing and reliability.
• Experience with package qualification and reliability methods (temperature cycling, HAST, shock, vibration, thermal characterization).
• Knowledge of JEDEC standards and package-design specs.

Responsibilities

• Lead chip-package co-design and package technology selection for new products.
• Develop package solutions across FCCSP, FCBGA, FCQFN, WLCSP, QFN and related platforms.
• Translate product, die, electrical, thermal, mechanical, reliability, manufacturing, and cost requirements into package designs.
• Collaborate with cross-functional teams throughout the product development lifecycle.
• Evaluate package architecture and material options against performance, cost, manufacturability, yield and schedule.
• Lead engagement with OSAT partners and suppliers through design reviews and production ramp.
• Review package drawings, substrate/leadframe designs, materials, and supplier requirements.
• Identify package-related risks and drive mitigation plans and corrective actions.
• Support thermo-mechanical modeling and correlation activities.
• Drive package qualification planning and execution with Quality and Reliability Engg.
• Support transfer of new package technologies to high-volume manufacturing.
• Improve workflows, design methodologies, supplier engagement models, and roadmaps.
• Document technical decisions and development results.

Skills

Signal integrity

Power integrity

Thermal management

Mechanical reliability

Technical communication

Project management

Cross-functional leadership

Education

Bachelors in Materials Science

Bachelors in Mechanical Engineering

Bachelors in Electrical Engineering

Bachelors in Chemical Engineering

Tools

Cadence Allegro

AutoCAD

Job description

Rambus in San Jose, CA is seeking a Principal Package Development Engineer to lead early chip-package co-design and select package technologies for high-performance products. You will drive cross-functional collaboration with design, SI/PI, Test, Quality, Reliability, Manufacturing, and Supply Chain to deliver reliable, low-defect package solutions.

The role requires deep expertise in semiconductor packaging technologies, qualification methods, and transfer to high-volume production.