Principal Lead Engineer - Wet Process, CMP & Bond MDE

Micron Technology, Inc; Boise (ID); On-site; USD 150,000 - 190,000; Full time

Job summary

Micron Technology, Inc. is seeking a Wet Process, CMP and Bond MDE Principal Lead Engineer to drive DRAM process development and roadmap execution.

The role includes leading cross-functional teams, managing 24/7 shift operations, and mentoring engineers to build a strong talent pipeline. The ideal candidate has a Bachelor’s degree in Engineering with demonstrated leadership in semiconductor manufacturing and expertise in wet process, CMP, wafer bonding, grinding, or edge trimming.

Qualifications

• Bachelor’s degree in Engineering or equivalent experience in the semiconductor field.
• Demonstrated leadership experience in a technical or manufacturing environment.
• Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming.
• Strong problem-solving and interpersonal skills.

Responsibilities

• Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery.
• Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes.
• Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line-down recovery.
• Mentor and develop engineers, building a pipeline of talent into process development roles.
• Improve workflows, development systems, and AI adoption to enhance efficiency and decision quality.

Skills

Leadership

Mentoring

Data-driven decision making

Problem-solving

Interpersonal skills

Education

Bachelor’s degree in Engineering

Tools

AI tools

Job description

Micron Technology, Inc. is seeking a Wet Process, CMP and Bond MDE Principal Lead Engineer to drive DRAM process development and roadmap execution.

The role includes leading cross-functional teams, managing 24/7 shift operations, and mentoring engineers to build a strong talent pipeline. The ideal candidate has a Bachelor’s degree in Engineering with demonstrated leadership in semiconductor manufacturing and expertise in wet process, CMP, wafer bonding, grinding, or edge trimming.