Principal High-Speed PCB Designer for ASIC Characterization

Teradyne; Agoura Hills (CA); Vor Ort; USD 198.000 - 316.000; Vollzeit

Benefits dieser Stelle

Medical, dental, vision

Retirement savings plans

Paid vacation & holidays

Tuition assistance

Zusammenfassung

Teradyne is hiring a Principal High-Speed Board Designer in Agoura Hills to lead the design and development of advanced prototype and system characterization boards for next-generation ASIC platforms. You will work closely with ASIC, package, SI, and system teams to optimize signal integrity, power integrity, and timing across the complete signal path, from package to instrument interfaces.

This role requires hands-on lab work, cross-functional collaboration, and the ability to drive bring-up

Qualifikationen

• BS/MS in Electrical Engineering or related field.
• 8+ years of experience designing high-performance digital and mixed-signal boards.
• Expertise in high-speed PCB design for data rates of 25 Gbps and above.
• Strong understanding of signal integrity, power integrity, timing, and system performance.
• Experience with industry-standard EDA tools.
• Experience with high-speed interfaces and protocols.
• Hands-on lab experience with oscilloscopes, VNAs, TDR/TDT, BERTs, and high-speed equipment.

Aufgaben

• Lead architecture, design, layout, and bring-up of high-speed characterization boards.
• Develop independent system characterization platforms to validate ASIC performance.
• Co-design the complete signal path from ASIC package to instrument interfaces.
• Define measurement methodologies for silicon characterization and debugging.
• Drive board bring-up, debugging, and root-cause analysis.
• Support prototype development through manufacturing, assembly, and lab validation.

Kenntnisse

High-speed design

PCB design

Signal integrity

Debugging

Ausbildung

BS/MS in Electrical Engineering

Tools

Ansys HFSS

Keysight ADS

Oscilloscopes

VNAs

TDR/TDT

Jobbeschreibung

Teradyne is hiring a Principal High-Speed Board Designer in Agoura Hills to lead the design and development of advanced prototype and system characterization boards for next-generation ASIC platforms. You will work closely with ASIC, package, SI, and system teams to optimize signal integrity, power integrity, and timing across the complete signal path, from package to instrument interfaces.

This role requires hands-on lab work, cross-functional collaboration, and the ability to drive bring-up