Principal HDI PCB Layout Designer – Aerospace/Defense

Northrop Grumman Corp.; Los Angeles (CA); On-site; USD 104,000 - 194,000; Full time

Benefits offered by this job

Health insurance

Company-paid holidays

Paid time off

Job summary

Northrop Grumman Corp. in Woodland Hills, CA, seeks a Principal/Sr. Principal PCB Layout Designer to design and deliver high-reliability circuit card assemblies for aerospace and defense applications. You will translate electrical schematics into production-ready PCB layouts, collaborating across design, manufacturing, and test teams.

The role emphasizes HDI techniques, via-in-pad and advanced manufacturing considerations, with on-site work required at the Woodland Hills facility.

Qualifications

• Bachelor’s degree in an engineering discipline with 5 years of aerospace or related experience; or Master’s with 2 years; 4 years acceptable in lieu of degree.
• Ability to obtain and maintain TS/SCI clearance.
• Willingness to work on-site at Woodland Hills, CA.
• 3+ years of PCB layout using Cadence Allegro or equivalent.

Responsibilities

• Execute placement and routing of complex, multi-layer PCBs (HDI, high-speed, RF, mixed-signal).
• Interpret schematics and constraints to meet performance and manufacturability.
• Produce fabrication and assembly documentation for procurement and assembly.
• Apply IPC and high-reliability criteria in design and verification.
• Collaborate with electrical, mechanical, manufacturing, and test teams.

Skills

PCB layout design

HDI

high-density PCBs

signal integrity

DFM/DFT

Education

Bachelor's degree in engineering

Master's degree in engineering

PhD in engineering

Tools

Cadence Allegro

Job description

Northrop Grumman Corp. in Woodland Hills, CA, seeks a Principal/Sr. Principal PCB Layout Designer to design and deliver high-reliability circuit card assemblies for aerospace and defense applications. You will translate electrical schematics into production-ready PCB layouts, collaborating across design, manufacturing, and test teams.

The role emphasizes HDI techniques, via-in-pad and advanced manufacturing considerations, with on-site work required at the Woodland Hills facility.