Principal PCB Layout Engineer - HDI & High-Reliability

Northrop Grumman; Los Angeles (CA); On-site; USD 114,000 - 213,000; Full time

Benefits offered by this job

Relocation assistance

Job summary

Northrop Grumman invites applications for a Principal / Sr. Principal PCB Layout Design Engineer based in Woodland Hills, CA. The role focuses on transforming complex electrical architectures into robust, production‑ready PCB solutions for aerospace, defense, and space flight applications.

The candidate will drive HDI, microvias, via‑in‑pad, and other advanced techniques, collaborating across electrical, mechanical, and manufacturing disciplines to ensure high reliability and manufacturability.

Qualifications

• Bachelor’s degree in engineering with 5 years of aerospace or related experience, or Master’s with 2 years.
• Ability to obtain and maintain a TS/SCI clearance.
• On‑site full‑time at Woodland Hills, CA.
• 3+ years of PCB layout using Cadence Allegro or similar tool.
• Experience with multi‑layer, high‑density PCBs and high‑speed, RF, or mixed‑signal layouts.

Responsibilities

• Execute placement and routing of complex, multi‑layer PCBs.
• Interpret schematics and constraints to meet performance and manufacturability.
• Generate PCB/CCA fabrication and assembly documentation for procurement.
• Apply IPC and high‑reliability standards to PCB designs.
• Collaborate with electrical, mechanical, manufacturing, and test teams to resolve design challenges.
• Support DFM/ DFA/ DFT reviews to improve yield and robustness.
• Work with suppliers to understand capabilities and constrain designs.

Skills

PCB layout

Cross‑functional teamwork

DFM/DFT reviews

TS/SCI clearance eligibility

Education

Bachelor’s degree in engineering

Tools

Cadence Allegro

HDI

Microvias

Via‑in‑pad

Job description

Northrop Grumman invites applications for a Principal / Sr. Principal PCB Layout Design Engineer based in Woodland Hills, CA. The role focuses on transforming complex electrical architectures into robust, production‑ready PCB solutions for aerospace, defense, and space flight applications.

The candidate will drive HDI, microvias, via‑in‑pad, and other advanced techniques, collaborating across electrical, mechanical, and manufacturing disciplines to ensure high reliability and manufacturability.