Principal Advanced Packaging Engineer (Hybrid)

Renesas; Austin (TX); Hybrid; USD 140,000 - 190,000; Full time

Job summary

Renesas Electronics America seeks a Principal Package Design Engineer to lead next‑gen packaging development for high-performance semiconductors. You will drive advanced packaging like 2.5D/3D, SiP, and BGA/CSP, and oversee architecture, simulations, and supply‑side collaboration.

You will partner with IC design, substrate, and manufacturing teams to ensure reliability, manufacturability, and cost targets while mentoring junior engineers and shaping qualification plans.

Qualifications

• Education: MSc or PhD in Electrical Engineering, Materials Science, Mechanical, Chemical Eng., or related field.
• Experience: 5+ years in advanced semiconductor packaging or system integration.
• Technical Depth: hands-on knowledge of packaging technologies, materials, assembly, and system integration for AI/data centers.
• Reliability & Tools: strong thermal/mechanical/electrical analysis; CAD and simulation proficiency; reliability testing experience.
• Supply Chain: experience with OSATs, substrates, assembly houses, and semiconductor supply chains.

Responsibilities

• Lead design, development, and qualification of advanced packaging solutions (2.5D/3D, SiP, BGA/CSP).
• Define package architecture based on electrical, thermal, mechanical, and cost requirements.
• Drive OSAT strategy and supplier development for new product introductions (NPI).
• Collaborate cross-functionally with IC design, substrates, and manufacturing to ensure package compatibility.
• Oversee layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations on signal integrity, thermal performance, and DFM.

Skills

Advanced packaging design

Cross-functional collaboration

Simulation & modeling

Thermal & mechanical analysis

Education

MSc in Electrical Engineering

PhD in a related field

Tools

Cadence Allegro Package Designer

SolidWorks

ANSYS

COMSOL

JMP / Minitab

Job description

Renesas Electronics America seeks a Principal Package Design Engineer to lead next‑gen packaging development for high-performance semiconductors. You will drive advanced packaging like 2.5D/3D, SiP, and BGA/CSP, and oversee architecture, simulations, and supply‑side collaboration.

You will partner with IC design, substrate, and manufacturing teams to ensure reliability, manufacturability, and cost targets while mentoring junior engineers and shaping qualification plans.