Precision Die Attach & Wire Bonding Technician

Micron Technology, Inc.; Boise (ID); On-site; USD 65,000 - 90,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a DQA WLR Technician to support die attach, wire bonding, and reliability testing.

The role involves data collection, equipment maintenance, and collaboration with engineering on samples and process improvements. The ideal candidate has an associate degree or hands-on semiconductor manufacturing experience, precise micromechanics skills, and basic data-entry capabilities.

Qualifications

• Associate degree or hands-on experience in semiconductor or precision manufacturing.
• Able to read detailed technical work instructions.
• Experience with data collection and reporting.

Responsibilities

• Perform die attach using automated die bonders.
• Wire bond devices and verify bond quality.
• Run electromigration and reliability stress tests.
• Collect, organize, and report data.
• Support preventive maintenance and calibration.
• Coordinate PMs and service calls with vendors.
• Leverage AI tools to summarize shift activities and document production issues.
• Assist with process documentation and safety procedures.
• Collaborate with engineering on sample builds and failure analysis.

Skills

Data entry

Spreadsheets

Test software

Attention to detail

Education

Associate degree / technical field

Tools

Die bonders

Ariba

Vision systems

Microscopes

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a DQA WLR Technician to support die attach, wire bonding, and reliability testing.

The role involves data collection, equipment maintenance, and collaboration with engineering on samples and process improvements. The ideal candidate has an associate degree or hands-on semiconductor manufacturing experience, precise micromechanics skills, and basic data-entry capabilities.