Semiconductor Assembly Technician: Precision Microfab

Micron Technology, Inc.; Boise (ID); On-site; USD 54,000 - 74,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Disability insurance

Job summary

Micron Technology, Inc. in Boise, ID is seeking an Assembly Process Technician to perform die attach, wire bonding, and reliability stress testing. You will collect data, troubleshoot equipment, and support ongoing process improvements in a clean manufacturing environment.

The role requires attention to detailed instructions, microscope work, and basic computer skills. This position includes collaboration with engineering on new builds and documentation of production activities.

Qualifications

• Associate degree or equivalent hands-on experience in semiconductor assembly or precision manufacturing.
• Ability to work under microscopes with small components.
• Proficient in data entry, spreadsheets, and test software.
• Strong attention to documentation and process instructions.

Responsibilities

• Perform die attach using automated die bonders, including dispensing conductive adhesives, die placement, alignment, and cure/fire profiles.
• Wire bond assembled devices and verify bond quality against established criteria.
• Set up, run, and monitor electromigration and reliability stress tests.
• Collect, organize, and report test data.
• Perform equipment troubleshooting, preventive maintenance, and calibration support on assembly and test tooling.
• Schedule PMs and service calls with vendor.
• Purchase parts and services through Ariba.
• Leverage Copilot or similar AI tools to summarize shift activities, generate maintenance reports, and document production issues.
• Support implementation of smart-manufacturing initiatives by providing operator feedback on AI tools and automated workflows.
• Follow and help improve written work instructions, process documentation, and safety procedures.
• Partner with engineering on new sample builds, process changes, and failure analysis support.

Skills

Attention to detail

Read and follow technical instructions

Basic computer skills

Microscope work precision

Education

Associate degree in electronics / engineering technology / manufacturing

Tools

Ariba

Copilot / AI tools for reporting

Automated die bonder operation

Job description

Micron Technology, Inc. in Boise, ID is seeking an Assembly Process Technician to perform die attach, wire bonding, and reliability stress testing. You will collect data, troubleshoot equipment, and support ongoing process improvements in a clean manufacturing environment.

The role requires attention to detailed instructions, microscope work, and basic computer skills. This position includes collaboration with engineering on new builds and documentation of production activities.