Postdoctoral Fellow - Semiconductor Packaging Reliability

Johns Hopkins University; Baltimore (MD); On-site; USD 70,000 - 100,000; Full time

Job summary

Johns Hopkins University is looking for a PREP Research Associate for a CHIPS funded project at the National Institute of Standards and Technology (NIST) in Baltimore, Maryland. The role involves developing new test methods and conducting detailed reliability analyses for advanced semiconductor packaging materials.

This position requires a Ph.D. in a relevant field and strong communication skills, with a preference for candidates experienced in polymer adhesion and semiconductor packaging. Join a dynamic team addressing crucial reliability testing challenges.

Qualifications

• Resident of the United States
• Strong oral and written communication skills required
• Experience in polymeric thin-film adhesion preferred

Responsibilities

• Develop and validate new test methods for multilayer adhesion in advanced packaging assemblies
• Characterize thermal and mechanical properties of materials before and after aging
• Conduct in‑situ environmental digital image correlation to quantify deformation
• Develop advanced failure‑analysis methods for complex structures
• Perform finite element analysis to simulate package deformation under loading
• Create datasets of material properties to support reliability modeling
• Communicate results through presentations and publications

Skills

Strong oral and written communication skills

Experience in polymeric thin-film adhesion

Experience in advanced semiconductor packaging

Education

Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Chemical Engineering, or Chemistry

Job description

Johns Hopkins University is looking for a PREP Research Associate for a CHIPS funded project at the National Institute of Standards and Technology (NIST) in Baltimore, Maryland. The role involves developing new test methods and conducting detailed reliability analyses for advanced semiconductor packaging materials.

This position requires a Ph.D. in a relevant field and strong communication skills, with a preference for candidates experienced in polymer adhesion and semiconductor packaging. Join a dynamic team addressing crucial reliability testing challenges.