Postdoctoral Fellow (PREP0004384)

Johns Hopkins University; Baltimore (MD); On-site; USD 62,000 - 86,000; Full time

Benefits offered by this job

Comprehensive healthcare benefits

Retirement plans

Career development opportunities

Job summary

Johns Hopkins University is hiring a Research Associate for a project funded by the CHIPS program. This role focuses on modeling and mechanical testing of advanced semiconductor packaging. Candidates should possess a Ph.D. in relevant fields and have expertise in finite element analysis.

The position requires strong communication skills and the ability to collaborate with various stakeholders in cutting-edge research aimed at advancing semiconductor reliability.

Qualifications

• U.S. citizenship is preferred.
• Currently live in the United States.
• Experience in nano- and micro-scale mechanical testing.
• Experience in advanced semiconductor packaging is preferred.

Responsibilities

• Develop finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterize degradation of materials before and after accelerated aging.
• Develop reliability models for advanced packaging systems.
• Provide technical leadership in modeling failure mechanisms.
• Disseminate research results through presentations and publications.

Skills

Finite element modeling

Mechanical testing

Materials characterization

Strong communication skills

Education

Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering

Job description

PREP Research Associate – CHIPS Funded Project

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest, and thus requires that such institutions be the recipient of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.

Research Title: Modeling and Mechanical Testing for Heterogenous Structures of Advanced Semiconductor Packaging

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with extensive expertise in finite element analysis and knowledge of one or more of the following technical areas: instrumented mechanical testing, adhesion testing, polymer degradation characterization, and material damage analysis and modeling.

If selected, you will play a significant role in projects related to modeling and reliability testing of advanced chip packaging and other electronics applications. This includes working with NIST staff and external partners on setting up models to predict the behavior and investigate possible points of failure during the service lifetime of heterogeneous multilayered polymeric, metal, and semiconductor structures, identify crucial material parameters, and plan and execute experimental research to evaluate changes of these material parameters after aging. The results will be used to understand the root causes of the multilayer failures, providing a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.

Key Responsibilities

• Developing finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
• Developing reliability models for complex advanced packaging systems.
• Providing technical leadership on finite element modeling of failure mechanisms in multilayered polymeric structures.
• Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.

Qualifications

• U.S. citizenship is preferred.
• Currently live in the United States.
• Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering.
• Experience in nano- and micro-scale mechanical testing and materials characterization.
• Experience in finite element modeling of heterogeneous systems.
• Experience in advanced semiconductor packaging is preferred.
• Strong oral and written communication skills.

Salary Range

The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University's good faith belief at the time of posting. Not all candidates will be eligible for the upper end of the salary range. The actual compensation offered to the selected candidate may vary and will ultimately depend on multiple factors, which may include the successful candidate's geographic location, skills, work experience, internal equity, market conditions, education/training and other factors, as reasonably determined by the University.

Total Rewards

Johns Hopkins offers a total rewards package that supports our employees' health, life, career and retirement. More information can be found here: https://hr.jhu.edu/benefits-worklife/.

Equal Opportunity Employer

The Johns Hopkins University is committed to equal opportunity for its faculty, staff, and students. To that end, the university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristics. The university is committed to providing qualified individuals access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit without regard to personal factors or demographic characteristics that are irrelevant to the program involved.

EEO Statement

Applications are accepted from all qualified individuals. The Office of Equal Employment Opportunity is available to assist applicants with questions regarding equal opportunity matters. For more information, visit https://www.eeoc.gov/employees-job-applicants.