Postdoc: Reliability & Failure Analysis in Packaging

Johns Hopkins University; Gaithersburg (MD); On-site; USD 70,000 - 100,000; Full time

Job summary

Johns Hopkins University is seeking a researcher for the National Institute of Standards (NIST) program focused on reliability testing and failure analysis in semiconductor packaging. The successful candidate will develop and validate new test methods while characterizing materials, performing finite element analysis, and conducting presentations.

A Ph.D. in Materials Science, Mechanical Engineering, or related fields is required, with experience in polymeric films and semiconductor packaging preferred. The role emphasizes strong communication skills and is open to U.S. citizens.

Qualifications

• Live in the United States.
• Strong oral and written communication skills.
• Experience in polymeric thin film adhesion.
• Experience in advanced semiconductor packaging is preferred.
• U.S. citizenship is preferred.

Responsibilities

• Develop and validate new test methods for multilayer adhesion.
• Characterize thermal and mechanical properties of materials.
• Conduct digital image correlation for package deformation.
• Develop failure‑analysis methods using microscopic techniques.
• Perform finite element analysis for package deformation.
• Create datasets of material properties for reliability modeling.
• Communicate results through publications and presentations.

Skills

Oral and written communication skills

Experience in polymeric thin film adhesion

Experience in advanced semiconductor packaging

Education

Ph.D. in relevant fields

Job description

Johns Hopkins University is seeking a researcher for the National Institute of Standards (NIST) program focused on reliability testing and failure analysis in semiconductor packaging. The successful candidate will develop and validate new test methods while characterizing materials, performing finite element analysis, and conducting presentations.

A Ph.D. in Materials Science, Mechanical Engineering, or related fields is required, with experience in polymeric films and semiconductor packaging preferred. The role emphasizes strong communication skills and is open to U.S. citizens.