Postdoctoral Fellow (PREP0004376)

Johns Hopkins University; Baltimore (MD); On-site; USD 70,000 - 100,000; Full time

Job summary

Johns Hopkins University is looking for a PREP Research Associate for a CHIPS funded project at the National Institute of Standards and Technology (NIST) in Baltimore, Maryland. The role involves developing new test methods and conducting detailed reliability analyses for advanced semiconductor packaging materials.

This position requires a Ph.D. in a relevant field and strong communication skills, with a preference for candidates experienced in polymer adhesion and semiconductor packaging. Join a dynamic team addressing crucial reliability testing challenges.

Qualifications

• Resident of the United States
• Strong oral and written communication skills required
• Experience in polymeric thin-film adhesion preferred

Responsibilities

• Develop and validate new test methods for multilayer adhesion in advanced packaging assemblies
• Characterize thermal and mechanical properties of materials before and after aging
• Conduct in‑situ environmental digital image correlation to quantify deformation
• Develop advanced failure‑analysis methods for complex structures
• Perform finite element analysis to simulate package deformation under loading
• Create datasets of material properties to support reliability modeling
• Communicate results through presentations and publications

Skills

Strong oral and written communication skills

Experience in polymeric thin-film adhesion

Experience in advanced semiconductor packaging

Education

Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Chemical Engineering, or Chemistry

Job description

Job Overview

PREP Research Associate – CHIPS funded project at National Institute of Standards and Technology (NIST). The incumbent works in the Infrastructure Materials Group, performing technical work that underpins reliability testing and failure analysis for advanced semiconductor packaging. The role involves integrating reliability modeling with experimental techniques to investigate how environmental stressors accelerate aging, property degradation, and failure mechanisms in complex package architectures.

Key Responsibilities

• Develop and validate new test methods for multilayer adhesion in advanced packaging assemblies.
• Characterize the thermal and mechanical properties of materials and interfaces before, during, and after accelerated aging.
• Conduct in‑situ environmental digital image correlation (DIC) to quantify package/assembly deformation during thermal cycling.
• Develop advanced failure‑analysis methods using microscopic and X‑ray‑based techniques for complex package structures.
• Perform finite element analysis to simulate package deformation/warpage under thermo‑mechanical loading, informing the development of more accurate reliability models.
• Create comprehensive datasets of material and interface properties, both pre‑ and post‑aging, to support reliability modeling.
• Communicate results through conference presentations, peer‑reviewed publications, and technical reports.

Qualifications

• Resident of the United States.
• Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Chemical Engineering, or Chemistry.
• Strong oral and written communication skills.
• Experience in polymeric thin‑film adhesion.
• Experience in advanced semiconductor packaging is preferred.
• U.S. citizenship is preferred.

Equal Opportunity Employer

The National Institute of Standards and Technology is an equal opportunity employer. It does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status, or other legally protected characteristics.