Nondestructive Metrology Research Associate

Johns Hopkins University; Baltimore (MD); In loco; USD 80.000 - 110.000; Tempo pieno

Descrizione del lavoro

Johns Hopkins University in Baltimore is seeking a PREP Research Associate to support a CHIPS-funded project focused on nondestructive defect detection metrology for advanced semiconductor packaging. The role involves collaborating within a multidisciplinary team to develop reference artifacts and benchmark datasets, and to perform both destructive and nondestructive measurements including XCT.

The candidate will contribute to automating workflows with Python, organizing measured data for

Competenze

• Bachelor's degree in physics, engineering, or related discipline.
• At least 5 years of relevant experience.
• Experience with XCT measurements, reconstruction, and image analysis.
• Experience with XCT simulation is a plus.
• Experience with sample preparation, FIB, and SEM.
• Experience with image segmentation using commercial or open‑source tools.
• Strong oral and written communication skills.
• Able to quickly learn and adapt to new fields or techniques.

Mansioni

• Prepare samples for focused ion beam or scanning electron microscopy measurements.
• Make X-ray computed tomography or laminography measurements.
• Design 3D models for simulation, run XCT simulations, carry out XCT reconstruction, and execute image analysis.
• Organize and prepare data sets for publication.
• Present results at internal meetings and occasional meetings with external stakeholders.
• Ensure that results, protocols, software, and documentation have been archived or otherwise transmitted to the larger organization.

Conoscenze

XCT measurements

Image analysis

Sample preparation (FIB/SEM)

Data management

Strong communication

Fast learner/adaptability

Formazione

Bachelor's degree in physics, engineering, or related discipline

Strumenti

FIB/SEM equipment

XCT simulations software

Descrizione del lavoro

Johns Hopkins University in Baltimore is seeking a PREP Research Associate to support a CHIPS-funded project focused on nondestructive defect detection metrology for advanced semiconductor packaging. The role involves collaborating within a multidisciplinary team to develop reference artifacts and benchmark datasets, and to perform both destructive and nondestructive measurements including XCT.

The candidate will contribute to automating workflows with Python, organizing measured data for